Patent classifications
C23C14/18
MAGNETICALLY-CONTROLLED GRAPHENE-BASED MICRO-/NANO-MOTOR AND FABRICATION METHOD THEREOF
A method of fabricating a magnetically-controlled graphene-based micro-/nano-motor includes: (a) mixing FeCl.sub.3 crystal powder with deionized water to obtain a FeCl.sub.3 solution; (b) completely immersing a carbon-based microsphere in the FeCl.sub.3 solution; transferring the carbon-based microsphere from the FeCl.sub.3 solution followed by heating to allow crystallization of FeCl.sub.3 on the surface of the carbon-based microsphere to obtain a FeCl.sub.3-carbon-based microsphere; (c) heating the FeCl.sub.3-carbon-based microsphere in a vacuum chamber until there is no moisture in the vacuum chamber; continuously removing gas in the vacuum chamber and introducing oxygen; and treating the FeCl.sub.3-carbon-based microsphere with a laser in an oxygen-enriched environment to obtain the magnetically controlled graphene-based micro-/nano-motor. A magnetically-controlled graphene-based micro-/nano-motor is further provided.
FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A film forming method includes: providing the substrate into the processing container; forming a metal-based film on the substrate within the processing container; and subsequently, supplying a Si-containing gas into the processing container in a state in which the substrate is provided within the processing container.
FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A film forming method includes: providing the substrate into the processing container; forming a metal-based film on the substrate within the processing container; and subsequently, supplying a Si-containing gas into the processing container in a state in which the substrate is provided within the processing container.
Innovation In High Performance Electro-Chromic Device Manufacturing Method
The invention relates to the manufacturing method of high performance electro-chromic devices containing transition metal oxide based compounds, wherein it comprises the steps of enlarging of the metal contact with Pt (Platinum) (1) sputtering method on one edge of the 80-150 nm thick Indium-Tin oxide alloy (ITO) (2), which was previously enlarged on the glass (3) by the sputter method, growing vertical nano-wall structures at 15-25 mTorr, 300-500° C. substrate temperature and at 3-45 minutes intervals on glass (3) with sputter method, by using transition metal chalcogen targets on previously enlarged ITO (2) with a thickness of 80-150 nm, oxidizing the grown structures in the oxidizing furnace for 10-60 minutes under oxygen gas in the temperature range 300-450° C., preparing the electro-chromic device by placing a counter glass/ITO (80-150 nm) in propylene carbonate (PC) to face 1 Mole/Liter Lithium perchlorate (LiClO4) ion-conducting electrolyte (6) with a 0.5-1 mm distance between them and closing it.
THIN METAL FILMS HAVING AN ULTRA-FLAT SURFACE AND METHODS OF PREPARING THE SAME
The present disclosure relates generally to thin metal films having an ultra-flat surface and methods of their preparation. In particular, the ultra-flat thin metal films comprise FCC metals. Preferably, the thin metal films are attached to a substrate. Preferred substrates comprise chalcogenides and dichalcogenides. Beneficially, the thin metal films described herein can be prepared at ambient temperatures.
THIN METAL FILMS HAVING AN ULTRA-FLAT SURFACE AND METHODS OF PREPARING THE SAME
The present disclosure relates generally to thin metal films having an ultra-flat surface and methods of their preparation. In particular, the ultra-flat thin metal films comprise FCC metals. Preferably, the thin metal films are attached to a substrate. Preferred substrates comprise chalcogenides and dichalcogenides. Beneficially, the thin metal films described herein can be prepared at ambient temperatures.
FILM FORMING APPARATUS, CONTROL APPARATUS FOR FILM FORMING APPARTUS, AND FILM FORMING METHOD
A film forming apparatus has a process chamber and a processing unit provided in the process chamber and forming adhesive film. The surface of the inner walls of the process chamber is formed of a material having a large getter effect on gas or water (H.sub.2O) remaining in the process chamber.
FILM FORMING APPARATUS, CONTROL APPARATUS FOR FILM FORMING APPARTUS, AND FILM FORMING METHOD
A film forming apparatus has a process chamber and a processing unit provided in the process chamber and forming adhesive film. The surface of the inner walls of the process chamber is formed of a material having a large getter effect on gas or water (H.sub.2O) remaining in the process chamber.
FILM FORMING METHOD AND FILM FORMING SYSTEM
A film forming method includes: preparing a substrate that includes a base substrate and a first conductive film that is formed on the base substrate; forming, on the first conductive film, a composite layer that includes layers of graphene and includes, as dopant atoms, a transition metal from 4th period to 6th period in a periodic table, excluding lanthanoids, between the layers of graphene; and forming, on the composite layer, a second conductive film which is electrically connected to the first conductive film via the composite layer.
FILM FORMING METHOD AND FILM FORMING SYSTEM
A film forming method includes: preparing a substrate that includes a base substrate and a first conductive film that is formed on the base substrate; forming, on the first conductive film, a composite layer that includes layers of graphene and includes, as dopant atoms, a transition metal from 4th period to 6th period in a periodic table, excluding lanthanoids, between the layers of graphene; and forming, on the composite layer, a second conductive film which is electrically connected to the first conductive film via the composite layer.