A method and apparatus for thermal evaporation are provided. The thermal evaporator includes a flat crucible design, which provides an increased surface area for evaporation of the material to be deposited relative to conventional designs. The increased surface area for evaporation means that the more vapor of the evaporated material can be produced, which increases pressure inside the evaporator body leading to increased flow of the evaporated material out of the nozzles. The flat crucible can be attached to an evaporator body of the thermal evaporator. The flat crucible can be integrated within the evaporator body. The evaporator body can include a plurality of longitudinal grooves, which increase the surface area of the evaporator body. The thermal evaporator can include a plurality of baffles which divide the thermal evaporator into separate compartments.

A sputtering method includes one or more sputtering processes. Each sputtering process includes in a first pre-sputtering phase, sputtering a target material on a baffle plate configured to shield a substrate; in a second pre-sputtering phase, sputtering a target material compound on the baffle plate; and in a main sputtering phase, sputtering the target material compound on the substrate. The first pre-sputtering phase is used to adjust a sputtering voltage for the main sputtering phase.

A stage for heating and cooling an object installed in a chamber 1 includes : a stage body 5, 6 that has a mounting surface on which an object is mounted; a heating unit 7 for heating the mounting surface; and a cooling unit 8 for cooling the mounting surface. The stage body 5, 6 also has a first groove 10 into which the heating unit is inserted and a second groove 10 into which the cooling unit is inserted. The gap between the first groove and the heating unit and the gap between the second groove and the cooling unit have a heat-conductive medium.

A film forming apparatus has a process chamber and a processing unit provided in the process chamber and forming adhesive film. The surface of the inner walls of the process chamber is formed of a material having a large getter effect on gas or water (H.sub.2O) remaining in the process chamber.

Provided are a display device, a mask assembly, and an apparatus and a method for manufacturing the display device. The mask assembly includes: a mask frame; at least two mask sheets installed on the mask frame, each of the mask sheets including a plurality of openings; and at least two thin shielding plates installed on the mask frame such that the thin shielding plates are spaced apart from each other and shield a portion of the plurality of openings of each mask sheet, wherein one of the mask sheets and the thin shielding plates includes a shielding portion between the thin shielding plates spaced apart from each other, the shielding portion selectively blocking at least portions of the openings so as to form a deposition region having a shape other than a rectangle or a square.

According to various embodiments, the temperature control roller may comprise: a cylindrical roller shell, which has a multiplicity of gas outlet openings; a temperature control device, which is configured to supply and/or extract thermal energy to or from the cylindrical roller shell; multiple gas lines made to extend along the axis of rotation; a gas distributing structure, which couples the multiple gas lines and the multiplicity of gas outlet openings to one another in a gas-conducting manner, the gas distributing structure having a lower structure density than the multiplicity of gas outlet openings.

Examples of a substrate transfer system include a chamber in which a plurality of through holes are formed on a side surface, a substrate transfer device provided in the chamber, and a lamp heater disposed in the chamber. The lamp heater is configured to heat an inner wall of the chamber and the substrate transfer device.

Disclosed herein is a sliding member having an alloy overlay layer that comes into sliding contact with a counterpart member thereof and has improved fatigue resistance. The sliding member comprises a base material layer and an alloy overlay layer formed on the base material layer, in which the alloy overlay layer has a soft metal phase made of tin and precipitated in a metallic matrix phase made of aluminum, and when an average aspect ratio of the soft metal phase is defined as A, and its standard deviation is defined as Aσ, A+Aσ is 3.0 or less. In this case, the soft metal phase has a shape close to a sphere without elongating in a certain direction.

A deposition system includes a system housing having a housing interior, a fixture transfer assembly having a generally sloped fixture transfer rail extending through the housing interior, a plurality of sequentially ordered deposition chambers connected by the fixture transfer rail, a controller interfacing with the processing chambers and at least one fixture carrier assembly carried by the fixture transfer rail and adapted to contain at least one substrate. The fixture carrier assembly travels along the fixture transfer rail under influence of gravity. A substrate fixture contains a substrate. The substrate fixture comprises a fixture frame. The fixture frame is defined by multiple circular members adjacently joined in a circular arrangement. Each circular member has a fixture frame opening sized to receive the substrate. Lens support arms may integrate into the circular members, extending in a curved disposition into the fixture frame opening to retain the substrate. A deposition method is also disclosed.

Examples disclosed herein relate to an apparatus and method of forming thin film layers on a substrate. A first piezoelectric material layer is deposited on the substrate in a first chamber. The first piezoelectric material layer is formed on the substrate while the substrate is at a first temperature. A second piezoelectric material layer is deposited on the first piezoelectric material layer after cooling the substrate to a second temperature. The second temperature is lower than the first temperature. The first piezoelectric material layer and the second piezoelectric material layer both comprise a first piezoelectric material.