A system and method are described for depositing a material onto a receiving surface, where the material is formed by use of a plasma to modify a source material in-transit to the receiving surface. The system comprises a microwave generator electronics stage. The system further includes a microwave applicator stage including a cavity resonator structure. The cavity resonator structure includes an outer conductor, an inner conductor, and a resonator cavity interposed between the outer conductor and the inner conductor. The system also includes a multi-component flow assembly including a laminar flow nozzle providing a shield gas, a zonal flow nozzle providing a functional process gas, and a source material flow nozzle configured to deliver the source material. The source material flow nozzle and zonal flow nozzle facilitate a reaction between the source material and the functional process gas within a plasma region.

Methods and systems for forming a structure including multiple carbon layers and structures formed using the method or system are disclosed. Exemplary methods include forming a first carbon layer and a second carbon layer, wherein a density and/or other property of the first carbon layer differs from the corresponding property of the second carbon layer.

Embodiments of the present disclosure relate to methods for depositing an amorphous carbon layer onto a substrate, including over previously formed layers on the substrate, using a plasma-enhanced chemical vapor deposition (PECVD) process. In particular, the methods described herein utilize a combination of RF AC power and pulsed DC power to create a plasma which deposits an amorphous carbon layer with a high ratio of sp3 (diamond-like) carbon to sp2 (graphite-like) carbon. The methods also provide for lower processing pressures, lower processing temperatures, and higher processing powers, each of which, alone or in combination, may further increase the relative fraction of sp3 carbon in the deposited amorphous carbon layer. As a result of the higher sp3 carbon fraction, the methods described herein provide amorphous carbon layers having improved density, rigidity, etch selectivity, and film stress as compared to amorphous carbon layers deposited by conventional methods.

Methods are disclosed for forming a Silicon Metal Oxide film using a mono-substituted TSA precursor. The precursors have the formula: (SiH3)2N—SiH2-X, wherein X is selected from a halogen atom; an isocyanato group; an amino group; an N-containing C4-C10 saturated or unsaturated heterocycle; or an alkoxy group.

Methods are disclosed for forming a Silicon Metal Oxide film using a mono-substituted TSA precursor. The precursors have the formula: (SiH3)2N—SiH2-X, wherein X is selected from a halogen atom; an isocyanato group; an amino group; an N-containing C4-C10 saturated or unsaturated heterocycle; or an alkoxy group.

A vanadium silicon carbide film contains vanadium, silicon, and carbon, in which the total of a vanadium element concentration, a silicon element concentration, and a carbon element concentration in the film is 90 at % or more.

A vanadium silicon carbide film contains vanadium, silicon, and carbon, in which the total of a vanadium element concentration, a silicon element concentration, and a carbon element concentration in the film is 90 at % or more.

There is a shower head through which a processing gas is supplied into an inside of a processing chamber, comprising: a cooling plate having a gas diffusion chamber, and a plurality of first through holes passing through from the gas diffusion chamber to a first surface on a processing chamber side; an upper electrode having a second surface in contact with the first surface of the cooling plate, a third surface configured to form an inner surface of the processing chamber, and a plurality of second through holes passing through from the second surface to the third surface; and a plurality of recesses formed in the first surface or the second surface and provided apart from each other, wherein one of the plurality of first through holes is connected to at least two of the plurality of second through holes via one of the plurality of recesses.

A DLC preparation apparatus and a preparation method. The DLC preparation apparatus comprises a body (10), a plasma source unit (50), and at least one gas supplying part (20). The body (10) is provided with a reaction chamber (100). The reaction chamber (100) is used for placing a substrate. The gas supplying part (20) is used for supplying a reaction gas to the reaction chamber (100). The plasma source unit (50) is provided outside of the body (10) and provides a radiofrequency electric field to the reaction chamber (100) to promote the generation of plasma, thus allowing the reaction gas to be deposited on the surface of the substrate by means of PECVD to form a DLC film.

A DLC preparation apparatus and a preparation method. The DLC preparation apparatus comprises a body (10), a plasma source unit (50), and at least one gas supplying part (20). The body (10) is provided with a reaction chamber (100). The reaction chamber (100) is used for placing a substrate. The gas supplying part (20) is used for supplying a reaction gas to the reaction chamber (100). The plasma source unit (50) is provided outside of the body (10) and provides a radiofrequency electric field to the reaction chamber (100) to promote the generation of plasma, thus allowing the reaction gas to be deposited on the surface of the substrate by means of PECVD to form a DLC film.