A method for fabricating an electronic component includes the steps of: forming a base material layer of, for example, nickel on a base material of copper, copper alloy, aluminium, or aluminium alloy; applying, as a catalyst, one or more metals selected from the group consisting of gold, palladium, platinum, silver, rhodium, cobalt, tin, copper, iridium, osmium, and ruthenium, on the base material layer; and forming a surface layer by an electroless tin plating bath including trivalent titanium as an reducing agent and pyrophosphate salt as a complexing agent. The surface layer has a thickness of 0.5 μm or more.

Compositions for electroless plating baths and their use are disclosed, and more particularly different solutions each usable to both makeup an original bath and to replenishment of the original bath.

A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.

Systems and methods for nickel plating include providing a tank that retains a plating bath into which a substrate is submerged, and creating a horizontal flow of processing solution in the plating bath to assist in carrying contaminants out of the plating bath. A sparger box may be positioned in the tank to deliver the processing solution into the plating bath in a horizontal direction. The processing solution, which carries the contaminants, may exit the plating bath through a plate member that includes a plurality of orifices and is also positioned in the tank. The orifices may have a variable opening size to help control outflow of the processing solution.

The disclosure discloses an online resourceful treatment method of electroless copper plating waste solution. According to the disclosure, a copper catalyst is adopted to perform autocatalytic reaction on electroless copper plating waste solution in an autocatalytic reactor, copper simple substances are reduced from copper ions in the waste solution and recycled, the treated waste solution enters into a three-dimensional electrolyzer and a membrane filtration plant for further purification, the finally treated electroless copper plating waste solution meets water quality discharge standard, and the recovery rate of the copper simple substances can reach up to above 95%.

A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.

A film-forming apparatus is connected to a carbon steel cleanup system pipe of a BWR plant. Formic acid and hydrogen peroxide are injected into the circulation pipe of the film-forming apparatus. An iron elution accelerator aqueous solution containing 3000 ppm of formic acid and 1500 ppm of hydrogen peroxide is brought into contact with the inner surface of the cleanup system pipe, and Fe2+ is eluted from the cleanup system pipe by formic acid, and hydroxyl radicals generated from hydrogen peroxide. The film-forming aqueous solution produced from the iron elution accelerator aqueous solution by injecting the nickel formate aqueous solution is brought into contact with the inner surface of the cleanup system pipe, and the Ni ions incorporated into the inner surface by the substitution reaction are reduced by the electrons generated at the time of elution of Fe2+ to form a Ni metal film on the inner surface thereof.

The disclosure discloses an online resourceful treatment method of electroless copper plating waste solution. According to the disclosure, a copper catalyst is adopted to perform autocatalytic reaction on electroless copper plating waste solution in an autocatalytic reactor, copper simple substances are reduced from copper ions in the waste solution and recycled, the treated waste solution enters into a three-dimensional electrolyzer and a membrane filtration plant for further purification, the finally treated electroless copper plating waste solution meets water quality discharge standard, and the recovery rate of the copper simple substances can reach up to above 95%.

A method for removing soluble ferrous iron from a galvanizing flux solution includes circulating the flux solution through a concentration loop and injecting ozone into the concentration loop, wherein the ozone mixes with the flux solution and reacts with soluble ferrous iron to form insoluble ferric iron in the loop. Flux solution that is substantially free of insoluble ferric iron may be removed from the concentration loop through a filter medium such as a cross-flow microfilter, thereby concentrating the ferric iron in the concentration loop. The ozone may be injected through an eductor that utilizes motive force from a circulation pump, thereby reducing energy consumption and providing rapid mixing and reaction of ozone and ferrous iron.

A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.