A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.

A new method for manufacturing a ferromagnetic part for an electromagnetic contactor, the ferromagnetic part having both particularly high impact mechanical durability, good ferromagnetic properties and good corrosion resistance, while integrating a non-magnetic gap. The method includes the following successive steps: a step a) of supplying a soft ferromagnetic metal blank part; and a step b) of electroless nickel plating at least one section of the blank part in order to obtain the ferromagnetic part, the section of which is surface coated with a nickel surface layer, with the obtained ferromagnetic part including the soft ferromagnetic metal, which, for at least one electroless nickel plated section, is disposed under the nickel surface layer.

An on-chip magnetic structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic material, and palladium substantially dispersed throughout the magnetic material.

An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.

A new method for manufacturing a ferromagnetic part for an electromagnetic contactor, the ferromagnetic part having both particularly high impact mechanical durability, good ferromagnetic properties and good corrosion resistance, while integrating a non-magnetic gap. The method includes the following successive steps: a step a) of supplying a soft ferromagnetic metal blank part; and a step b) of electroless nickel plating at least one section of the blank part in order to obtain the ferromagnetic part, the section of which is surface coated with a nickel surface layer, with the obtained ferromagnetic part including the soft ferromagnetic metal, which, for at least one electroless nickel plated section, is disposed under the nickel surface layer.

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A coating for protecting a base material from wear and corrosion includes a first layer deposited directly onto an outer surface of the base material. In addition, the coating includes a second layer deposited directly onto the first layer. The first layer is positioned between the base material and the second layer. The first layer includes chromium having a first micro-crack density and the second layer comprises chromium having a second micro-crack density that is less than the first micro-crack density.

A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.