Provided is a method for producing a composite alloy for use in an electrode for an alkaline storage battery, including a powder preparation step of preparing a hydrogen storage alloy powder containing Ti and Cr and having a BCC structure, an etching step of applying an acid to the hydrogen storage alloy powder prepared in the powder preparation step, a Pd film forming step of coating the surface of the hydrogen storage alloy powder subjected to the etching step with Pd using a substitution plating method, and a heat treatment step of heating the hydrogen storage alloy powder having a Pd film formed, at said heating being a temperature of 500° C. or less, wherein in the Pd coating forming step, the hydrogen storage alloy powder is coated with Pd under the condition that the Pd element weight ratio of the composite alloy to be produced is 0.47% or more.

Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.

A heteroepitaxial structure includes a first metal portion having a polycrystalline structure, a second metal portion on the first metal portion, the second metal portion has an island-shaped structure on the first metal portion, the second metal portion is provided corresponding to at least one crystalline grain exposed to a surface of the first metal portion, and the second metal portion and the at least one crystalline grain have a heteroepitaxial interface.

A method for fabricating an electronic component includes the steps of: forming a base material layer of, for example, nickel on a base material of copper, copper alloy, aluminium, or aluminium alloy; applying, as a catalyst, one or more metals selected from the group consisting of gold, palladium, platinum, silver, rhodium, cobalt, tin, copper, iridium, osmium, and ruthenium, on the base material layer; and forming a surface layer by an electroless tin plating bath including trivalent titanium as an reducing agent and pyrophosphate salt as a complexing agent. The surface layer has a thickness of 0.5 μm or more.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

A conformally metal-coated glass capillary array and method of fabricating same. A glass capillary array is provided. The glass capillary array includes a plurality of glass capillaries. The glass capillary array includes a plurality of glass capillary array walls. The plurality of glass capillary array walls define a plurality of holes. The plurality of holes includes a plurality of hole peripheries. An electroless metallization catalyst is provided around the plurality of hole peripheries. A first metal is electroless plated on the plurality of glass capillary array walls using the electroless metallization catalyst. A second metal is electroplated on the electroless-plated, first metal, or the second metal is electroless-plated on the electroless-plated, first metal.

The invention relates to a method of manufacture of a scroll compressor (1), in particular for pretreatment for the coating of areas in contact with one another during operation of the scroll compressor (1). The scroll compressor (1) is developed with a non-movable spiral (3) with a base plate (3a) and a spiral-form wall (3b) extending from one side of the base plate (3a), as well as with a movable spiral (4) with a base plate (4a) and a spiral-form wall (4b) extending from a front side of the base plate (4a). The spirals (3, 4) are developed out of a basis material.

Embodiments of the present disclosure generally relate to housings and enclosures for electronic devices and memory devices, and more specifically to such housings and enclosures having nickel-boron coatings and processes for forming such nickel-boron coatings. In an embodiment is provided an article for housing at least a portion of an electronic device that includes a metal-containing substrate, and a layer comprising nickel and boron, the layer disposed on at least a portion of the metal-containing substrate, wherein: an amount of nickel in the layer is about 95 wt % or more and an amount of boron in the layer is about 5 wt % or less based on the total amount of nickel and boron in the layer. The article has a thermal conductivity of about 25 W/mK or more, a scratch hardness of about 0.5 GPa or more, a coefficient of friction of about 0.4 or less, or combinations thereof.

Cleaning solution for cleaning and/or wetting metal surfaces, comprising at least one acid, a first surfactant, which is an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ≤25° C., a second surfactant, which is selected from the group consisting of i) an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ≥30° C., ii) an alkyl-polyethyleneglycol-ether having a cloud point of ≥45° C.
wherein the cloud points are determined according to European Standard EN 1890:2006, item 8.2 of German Version, with the modification that 10 wt % H.sub.2SO.sub.4 is used as solvent and that the concentration of the surfactant is 1000 mg/L.