The present disclosure provides a method for preparing a titanium-resin assembly for improving the adhesion strength between a substrate containing titanium and a resin, which includes: a first pore formation step of immersing a substrate comprising titanium in a first solution and forming pores in the substrate by etching the same; a second pore formation step of immersing the substrate having pores formed in the first pore formation step in a second solution and forming another pores by etching the same; an electrolysis step of immersing the substrate that has undergone the second pore formation step in an electrolytic solution and conducting electrolysis; and a molding step of joining the substrate with a polymer resin and conducting injection molding, wherein the first solution is an alkaline solution with a pH>7 and the second solution is an acidic solution with a pH<7.

The present disclosure provides a method for preparing a titanium-resin assembly for improving the adhesion strength between a substrate containing titanium and a resin, which includes: a first pore formation step of immersing a substrate comprising titanium in a first solution and forming pores in the substrate by etching the same; a second pore formation step of immersing the substrate having pores formed in the first pore formation step in a second solution and forming another pores by etching the same; an electrolysis step of immersing the substrate that has undergone the second pore formation step in an electrolytic solution and conducting electrolysis; and a molding step of joining the substrate with a polymer resin and conducting injection molding, wherein the first solution is an alkaline solution with a pH>7 and the second solution is an acidic solution with a pH<7.

A titanium surface treatment method for manufacturing a polymer-titanium joint structure having excellent bond strength is provided. A titanium surface treatment method for bonding with a polymer composite includes a first etching step wherein the titanium surface is etched by acidic solution; a first surface treatment step wherein the titanium surface is treated by ultrasonic wave; a second etching step wherein the titanium surface is etched again by acidic solution; a second surface treatment step wherein the titanium surface is treated again by ultrasonic wave; a first silane coupling treatment step wherein the titanium surface is treated by ultrasonic wave; a third surface treatment step wherein the titanium surface is treated again by ultrasonic wave; and a second silane coupling treatment step wherein the titanium surface is treated by anodic oxidation.

A method for manufacturing a ruthenium wiring including (i) treating a metal surface including ruthenium using a first chemical solution including a compound having a functional group capable of coordinating to a ruthenium atom, and (ii) carrying out an etching treatment on the metal surface including ruthenium treated with the first chemical solution, using a second chemical solution.

A method for manufacturing a ruthenium wiring including (i) treating a metal surface including ruthenium using a first chemical solution including a compound having a functional group capable of coordinating to a ruthenium atom, and (ii) carrying out an etching treatment on the metal surface including ruthenium treated with the first chemical solution, using a second chemical solution.

The object of the present invention is to provide: an etching agent for a titanium-based metal on a semiconductor substrate, which suppresses decomposition of hydrogen peroxide, has a long liquid service life, and has less need for controlling the concentration of hydrogen peroxide in the etching agent, even in the cases where the etching agent is used for a semiconductor substrate having the titanium-based metal and a metallic copper or a metal alloy; an etching method; and an etching agent preparation liquid for use by mixing with hydrogen peroxide. The present invention relates to: an etching agent for a titanium-based metal on a semiconductor substrate, having a titanium-based metal and a metallic copper or a copper alloy on the upper part of the titanium-based metal, comprising an aqueous solution containing at least (A) hydrogen peroxide, (B) phosphonic acid-based chelating agent having a nitrogen atom in the structure, (C) alkali metal hydroxide, and (D) organic acid having at least one hydroxyl group and at least three carboxyl groups; an etching method, which comprises using the etching agent; and an etching agent preparation liquid for use by mixing with hydrogen peroxide.

The object of the present invention is to provide: an etching agent for a titanium-based metal on a semiconductor substrate, which suppresses decomposition of hydrogen peroxide, has a long liquid service life, and has less need for controlling the concentration of hydrogen peroxide in the etching agent, even in the cases where the etching agent is used for a semiconductor substrate having the titanium-based metal and a metallic copper or a metal alloy; an etching method; and an etching agent preparation liquid for use by mixing with hydrogen peroxide. The present invention relates to: an etching agent for a titanium-based metal on a semiconductor substrate, having a titanium-based metal and a metallic copper or a copper alloy on the upper part of the titanium-based metal, comprising an aqueous solution containing at least (A) hydrogen peroxide, (B) phosphonic acid-based chelating agent having a nitrogen atom in the structure, (C) alkali metal hydroxide, and (D) organic acid having at least one hydroxyl group and at least three carboxyl groups; an etching method, which comprises using the etching agent; and an etching agent preparation liquid for use by mixing with hydrogen peroxide.

A method is disclosed for producing a plasmonic-nanostructure spectrally selective solar absorber having high solar absorptance, low thermal emittance, and superior thermal stability. The method includes the steps of providing an alloy structure containing a base metal and a copper alloying impurity, wherein copper has a weight percent concentration in the alloy of at least 0.25%; and applying an alkaline solution to a surface of the alloy structure to selectively dissolve base metal elements at the surface resulting in fabrication of sponge-like copper nanostructures on the surface configured to scatter, trap, and absorb light in solar wavelengths.

A method is disclosed for producing a plasmonic-nanostructure spectrally selective solar absorber having high solar absorptance, low thermal emittance, and superior thermal stability. The method includes the steps of providing an alloy structure containing a base metal and a copper alloying impurity, wherein copper has a weight percent concentration in the alloy of at least 0.25%; and applying an alkaline solution to a surface of the alloy structure to selectively dissolve base metal elements at the surface resulting in fabrication of sponge-like copper nanostructures on the surface configured to scatter, trap, and absorb light in solar wavelengths.

The present disclosure provides a metal-resin composite and a method of preparing the same. The metal includes titanium or titanium alloy, the composite includes a metal substrate and a resin layer coated on at least a part of a surface of the metal substrate, recesses are distributed on the part of the surface of the metal substrate coated with the resin layer, a part of resin of the resin layer extends to fill in the recesses, and a concentration of an oxygen element on the surface of the metal substrate is greater than 1 wt %. The method includes dipping a metal substrate in an etching solution containing at least one alkali metal hydroxide so as to form recesses on the surface of the metal substrate, and injecting a resin onto the surface of the after-surface-treatment metal substrate to form a resin layer. The metal-resin composite of the present disclosure is suitable for a shell of an electronic product.