There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.

A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.

The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.

An e-coat line includes a frame supporting a process track configured to extend along a process direction, a workpiece rack moveably supported on the frame, and a plurality of electrodes supported on an electrode rack. The rack includes support members configured to hold a plurality of hollow workpieces in a predetermined arrangement, and the workpiece rack is moveable relative to the frame between a raised position and a lowered position. The plurality of electrodes are supported on the electrode rack in a predetermined arrangement complementary to the predetermined arrangement of the plurality of hollow workpieces on the support members. The electrode rack is moveable relative to the workpiece rack in a direction crossing the process direction between a first position, in which the plurality of electrodes are extended along and overlapping with the support members to fit within the plurality of hollow workpieces, and a second position, in which the plurality of electrodes are retracted away from the support members to be removed from the plurality of hollow workpieces.

An e-coat line includes a frame supporting a process track configured to extend along a process direction, a workpiece rack moveably supported on the frame, and a plurality of electrodes supported on an electrode rack. The rack includes support members configured to hold a plurality of hollow workpieces in a predetermined arrangement, and the workpiece rack is moveable relative to the frame between a raised position and a lowered position. The plurality of electrodes are supported on the electrode rack in a predetermined arrangement complementary to the predetermined arrangement of the plurality of hollow workpieces on the support members. The electrode rack is moveable relative to the workpiece rack in a direction crossing the process direction between a first position, in which the plurality of electrodes are extended along and overlapping with the support members to fit within the plurality of hollow workpieces, and a second position, in which the plurality of electrodes are retracted away from the support members to be removed from the plurality of hollow workpieces.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.