Patent classifications
F27D2009/0081
Cooling system and method for decoaters
A cooling system for the decoating system includes a sensor, a control device, and a controller communicatively coupled with the sensor and the control device. The sensor is configured to measure a characteristic of the cooling system in the decoating system, the control device controls the characteristic of the cooling system, and the controller is configured to adjust the control device to adjust the characteristic of the cooling system based on at least one of a measured temperature within the decoating system or the measured characteristic. A method of controlling a temperature of the decoating system includes measuring a temperature within a piece of equipment of the decoating system and measuring a characteristic the cooling system in the piece of equipment of the decoating system. The method includes controlling the cooling system to adjust the characteristic based on at least one of the measured temperature or the measured characteristic.
COOLING SYSTEM AND METHOD FOR DECOATERS
A cooling system for the decoating system includes a sensor, a control device, and a controller communicatively coupled with the sensor and the control device. The sensor is configured to measure a characteristic of the cooling system in the decoating system, the control device controls the characteristic of the cooling system, and the controller is configured to adjust the control device to adjust the characteristic of the cooling system based on at least one of a measured temperature within the decoating system or the measured characteristic. A method of controlling a temperature of the decoating system includes measuring a temperature within a piece of equipment of the decoating system and measuring a characteristic the cooling system in the piece of equipment of the decoating system. The method includes controlling the cooling system to adjust the characteristic based on at least one of the measured temperature or the measured characteristic.
Temperature-control unit for a furnace device for heat treating a plate
The present invention relates to a temperature-control unit for a furnace device for heat treating a plate, in particular a metal plate. The temperature-control unit has a temperature-control body, which is arrangeable in a furnace chamber of the furnace device. The temperature-control body has a plurality of receiving bores. Furthermore, the temperature-control unit has a plurality of temperature-control pins, wherein the temperature-control pins are mounted in the receiving bores movably relative to the temperature-control body. The temperature-control pins are controllable in such a way that a temperature-control group of the temperature-control pins is extendable from the temperature-control body in the direction towards the plate, so that a thermal contact between the temperature-control group of the temperature-control pins and a predetermined temperature-control zone of the plate is generatable.
MULTI-CHAMBER HEAT TREATMENT DEVICE
A multi-chamber heat treatment device according to the present disclosure in which heating chambers are disposed with an intermediate transport chamber interposed therebetween in a top view, and a treatment object is stored in a heating chamber via the intermediate transport chamber, wherein the multi-chamber heat treatment device includes a gas cooling chamber which cools the treatment object using a cooling gas; and a cooling gas circulation device which includes an gas inlet and a gas outlet.
COOLING METHOD AND DEVICE FOR COOLING A WIRE AND CORRESPONDING WIRE-PROCESSING INSTALLATION
Cooling device (1) for cooling a wire (100), comprising a first chamber (2) and a second cooling chamber (4) through which the wire (100) passes. The device also comprises cooling liquid driving means (16) for driving the cooling liquid from the first chamber (2) to the second chamber (4) through at least one coding liquid inlet (12). Through the driving means (16) and the cooling liquid inlet (12), a jet of coding liquid is projected on the wire path at a mean speed of at least 0.6 m/s, and at a distance between 6 and 13 times the diameter of the wire (100). Cooling is performed in an inert gas atmosphere inside the second chamber (4). The invention also relates to a corresponding installation and a corresponding wire cooling method.
Cooling device and method for cooling elements passing through said device
The invention relates to a cooling device (100) for cooling at least one element (150, 151) passing through said device, comprising a metal block (115), having a first side and a second side, and comprising a cooling channel (130) for cyrogenic gas. The at least one element (150, 151) can be guided along the sides of the first side of the metal block (115), the cooling channel (130) is at least partially in heat conductive connection with the second side of the metal block (115), and the cooling channel (130) has an attachment (131) on a first end for the entry of cryogenic gas and an attachment on a second end for the exit of cryogenic gas. The invention also comprises a hardening device having such a cooling device (100) and a method for cooling at least one element (150, 151) passing through said device.
TEMPERATURE-CONTROL UNIT FOR A FURNACE DEVICE FOR HEAT TREATING A PLATE
The present invention relates to a temperature-control unit for a furnace device for heat treating a plate, in particular a metal plate. The temperature-control unit has a temperature-control body, which is arrangeable in a furnace chamber of the furnace device. The temperature-control body has a plurality of receiving bores. Furthermore, the temperature-control unit has a plurality of temperature-control pins, wherein the temperature-control pins are mounted in the receiving bores movably relative to the temperature-control body. The temperature-control pins are controllable in such a way that a temperature-control group of the temperature-control pins is extendable from the temperature-control body in the direction towards the plate, so that a thermal contact between the temperature-control group of the temperature-control pins and a predetermined temperature-control zone of the plate is generatable.
Solidifying device
A solidifying device is for solidifying a substrate which includes a middle and two side portions. The thermostability of the middle portion is greater than that of the side portions. The solidifying device includes a housing, a heating member, a temperature control air-floating member and a conveyor. The housing defines a working space. The heating member is in the working space. The substrate has a heat receiving surface facing the heating member. The temperature control air-floating member is in the working space and below the heating member. The conveyor is for transporting the substrate into the working space and between the temperature control air-floating member and the heating member. The heating member is for providing heat to the substrate. The temperature control air-floating member is for supplying air towards the substrate to allow the substrate to float in the working space and form a high-temperature and two low-temperature areas.
COOLING SYSTEM AND METHOD FOR DECOATERS
A cooling system for the decoating system includes a sensor, a control device, and a controller communicatively coupled with the sensor and the control device. The sensor is configured to measure a characteristic of the cooling system in the decoating system, the control device controls the characteristic of the cooling system, and the controller is configured to adjust the control device to adjust the characteristic of the cooling system based on at least one of a measured temperature within the decoating system or the measured characteristic. A method of controlling a temperature of the decoating system includes measuring a temperature within a piece of equipment of the decoating system and measuring a characteristic the cooling system in the piece of equipment of the decoating system. The method includes controlling the cooling system to adjust the characteristic based on at least one of the measured temperature or the measured characteristic.
Multi-chamber heat treatment device
A multi-chamber heat treatment device according to the present disclosure in which heating chambers are disposed with an intermediate transport chamber interposed therebetween in a top view, and a treatment object is stored in a heating chamber via the intermediate transport chamber, wherein the multi-chamber heat treatment device includes a gas cooling chamber which cools the treatment object using a cooling gas; and a cooling gas circulation device which includes an gas inlet and a gas outlet.