A heat exchanger including a sealed housing and a body positioned inside the housing, the body including a stack of least one first assembly of first and second plates pressed against each other, between which flows a first fluid, and at least one second assembly of third and fourth plates pressed against each other, between which flows a second fluid, the first and second assemblies being arranged so that they transfer heat between the first and second fluids. This configuration limits the risk of leaks and mixing of the two fluids.

A heat transfer device includes a first member and a first and second heat transfer element. In the first heat transfer element, a first contact area that is a contact area between the first heat transfer element and the first member varies. In the second heat transfer element, a second contact area that is a contact area between the second heat transfer element and the first member varies. The first contact area is greater when magnitude of a first external force applied to the first member is smaller than a first threshold than when the magnitude of the first external force is equal to or greater than the first threshold. The second contact area is smaller when the magnitude of the first external force is smaller than the first threshold than when the magnitude of the first external force is equal to or greater than the first threshold.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

Provided is a thermal conduction sheet, including graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles, in which: when the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N.Math.mm or higher at 25° C.

An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.

graphite composite laminated heat-dissipating structure and a manufacturing method thereof are disclosed. The structure includes a metal substrate and a graphite heat-dissipating layer. The metal substrate has a first surface having a roughness ranging between 0.01 and 10 μm. The graphite heat-dissipating layer is composed of pure graphite and is directly formed on the first surface by means of physical vapor deposition using a carbon sputtering target. The graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 μm. The manufacturing method includes S1: directly forming a graphite heat-dissipating layer on a first surface of a metal substrate by means of physical vapor deposition using a carbon sputtering target after the metal substrate has received plasma treatment or infrared heating; and S2: stopping the physical vapor deposition when the graphite heat-dissipating layer has a thickness ranging between 0.05 and 2 μm.

A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet,when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N.Math.mm or higher at 25° C.

An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

A device in a utility distribution system may comprise a housing, a heat source, a first heat sink, a second heat sink, a heat pipe, and a flexible directional thermal interface material (“DTIM”) with a high-conductivity orientation. The first heat sink may be thermally coupled to the heat source. The second heat sink may be attached to the first heat sink, and the flexible DTIM and the heat pipe may be arranged between the first and second heat sinks. The flexible DTIM may be thermally coupled with the first heat sink and the heat pipe. The heat pipe may be capable of movements with respect to the flexible DTIM. During the movements, the heat pipe may maintain the thermal coupling with the flexible DTIM, such that heat present in the first heat sink may be transferred to the heat pipe via the high-conductivity orientation of the flexible DTIM.