The invention provides in one embodiment a heat exchanger module (1) comprising a) a flexible support (100); b) at least one tubular member (200) having its main axis substantially parallel with the plane of the flexible support (100); c) a conductive flexible matrix (300) embedding the at least one tubular member (200); and d) a flexible case (400) enwrapping the flexible support (100), the at least one tubular member (200) and the conductive flexible matrix (300). A coating for a built environment comprising a plurality of heat exchanger modules (1) can be implemented, as well as a system further including pumping means (600). The invention also foresees a method for providing heat exchange processes between the heat exchanger module (1), the coating or the system of the invention and a built environment.

A heat sink (10) comprising a plurality of parallel fins (12) and a plurality of plates (14). Each plate (14) is located between an adjacent pair of fins (12) and one or more securing members is provided to secure the fins (12) and plates (14) in contact. Each of the plates (14) is formed of a material being softer than the material of the fins (12) such that compression of the fins (12) and plates (14) deforms the surface of the plates (14) to improve thermal conductivity between adjacent fins (12).

At least one heat pipe is fixed to each of fin plates, a rectangular fin plate assembly is constituted of the fin plate, the fin plate and the fin plate of the plurality of respective radiation fin parts as the plurality of radiation fin parts are seen from the direction in which the heat pipes extend, the plurality of heat pipes include a first heat pipe group and a second heat pipe group, the first heat pipe group is positioned at the center in the longitudinal direction of the fin plate assembly, the second heat pipe group is positioned on both sides of the first heat pipe group in the longitudinal direction of the fin plate assembly, and the fin plate thermally connected to the first heat pipe group includes expanding parts.

A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.

A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.

A curable thermal interface material and a cooling device, and a cooling device manufacturing method thereof are provided. The curable thermal interface material includes thermal conductive material and polymeric material, which is formed from the mixture of thermal conductive material and polymeric material. The curable thermal interface material is disposed on the heat sink, so as to properly conduct heat from the heat source to the heat sink to achieve heat dissipation.

A heat conduction member includes: a cylindrical ceramic body, a metal pipe on the outer periphery side of the cylindrical ceramic body, and an intermediate member held between the cylindrical ceramic body and the metal pipe. The cylindrical ceramic body has passages passing through from one end face to the other end face and allowing the first fluid to flow therethrough. The intermediate member is made of material having at least a part having a Young's modulus of 150 Gpa or less. The first fluid is allowed to flow through the inside of the cylindrical ceramic body while the second fluid having lower temperature than that of the first fluid is allowed to flow on the outer peripheral face side of the metal pipe to perform heat exchange between the first fluid and the second fluid.

A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Negative-stiffness-producing mechanisms can be incorporated with structural devices that are used on spacecraft that provide thermal coupling between a vibrating source and a vibration-sensitive object. Negative-stiffness-producing mechanisms can be associated with a flexible conductive link (FCL) or “thermal strap” or “cold strap” to reduce the positive stiffness of the FCL. The negative-stiffness-producing mechanisms can be loaded so as to create negative stiffness that will reduce or negate the natural positive stiffness inherent with the FCL. The FCL will still be able to provide maximum thermal conductance while achieving low or near-zero stiffness to maximize structural decoupling.

An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.