A wick assembly for use with a heat pipe is disclosed. The wick assembly includes an end plug including a wick receiving area, a wick, and a crimp. A portion of the wick is positioned about the wick receiving area. The crimp is positioned about the portion of the wick and the wick receiving area. The end plug, the portion of the wick, and the crimp are diffusion bonded.

A heat exchanger includes a first flow path member including a first plate having a first flow path portion providing a plurality of flow paths through which a first fluid flows, and a first bonding plate diffusion-bonded to the first plate to cover the first flow path portion; and a second flow path member including a second plate having a second flow path portion providing a plurality of flow paths through which a second fluid for exchanging heat with the first fluid flows. The first flow path member and the second flow path member are diffusion-bonded to each other.

A heat exchanger includes a body having an inlet header through which a fluid is introduced, and an outlet header through which the fluid is discharged; and one or more plates accommodated in the body and provided with flow path modules providing flow paths for the fluid introduced through the inlet header to flow to the outlet header. The heat exchanger further includes at least one flow path adjuster each having at least a portion thereof accommodated in the body and being movable or rotatable to open or close a part or all of the flow paths or to change directions of the flow paths so that a flow of the fluid is adjusted.

A fuselage heat exchanger having channels for dissipating waste heat generated by fuel cells that power unmanned aerial vehicles (UAVs) or drones. A heat exchanger built into the fuselage can dissipate such waste heat. Coolant flowing through channels embedded within an aircraft fuselage panel dissipates heat to airflow around the outer surface of the fuselage.

A heat exchanger module having at least two fluid circuits, of longitudinal axis including a stack of plates, defining at least two fluid circuits, at least a part of the plates each including fluid circulation channels, the channels of at least one of the two circuits, referred to as first circuit, having at least one fluid supply and distribution zone for supplying and distributing fluid from outside the stack, forming a fluid pre-header, in which zone the channels are delimited by studs distributed over the surface of the plate; an exchange zone continuous with the pre-header and wherein the channels are each delimited by a groove separated from one another by a rib and extending along the longitudinal axis.

At least one of an evaporator, a condenser, a liquid pipe, and a vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer including a porous body. The porous body includes a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, and a first convex portion provided inside the first bottomed hole. The first convex portion has a proximal end connected to a bottom face of the first bottomed hole and a distal end provided on an opposite side to the proximal end in a thickness direction of the first convex portion. The distal end is provided at a position further recessed toward the bottom face of the first bottomed hole than the one face of the inner metal layer.

A wick assembly for use with a heat pipe is disclosed. The wick assembly includes an end plug including a wick receiving area, a wick, and a crimp. A portion of the wick is positioned about the wick receiving area. The crimp is positioned about the portion of the wick and the wick receiving area. The end plug, the portion of the wick, and the crimp are diffusion bonded.

A method of manufacturing a heat exchanger is provided. The method includes forming a first substrate by additively manufacturing a body defining a first outer surface and a second outer surface opposite the first outer surface, a first partial fluid flow channel formed within the first outer surface, a second partial fluid flow channel formed within the second outer surface, and at least one internal fluid flow channel completely formed within the body, and coupling the first substrate to a second substrate including a partial fluid flow channel formed within a surface of the second substrate such that the first partial fluid flow channel of the first substrate and the partial fluid flow channel of the second substrate combine to form a combined fluid flow channel.

A method of manufacturing a heat exchanger is provided. The method includes forming a first substrate by additively manufacturing a body defining a first outer surface and a second outer surface opposite the first outer surface, a first partial fluid flow channel formed within the first outer surface, a second partial fluid flow channel formed within the second outer surface, and at least one internal fluid flow channel completely formed within the body, and coupling the first substrate to a second substrate including a partial fluid flow channel formed within a surface of the second substrate such that the first partial fluid flow channel of the first substrate and the partial fluid flow channel of the second substrate combine to form a combined fluid flow channel.

A flat plate heat exchanger module for use in aerospace applications, automotive applications, industrial applications or similar. The flat plate heat exchanger module comprises a stack of heat exchanger plates, where at least one of the heat exchanger plates further comprises at least one elongated aperture extending across the surface of the heat exchanger plate. This elongated aperture is in fluid isolation from the fluid flowing across the surface of the heat exchanger plate. The use of at least one elongated aperture throughout the stack of heat exchanger plates minimises the overall effect of the expansion and contraction of the metal due to exposure to high temperature gradients. A method of manufacturing such a heat exchanger module is also provided.