A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.

An automated system is provided. The system includes: a manipulator coupled to: an opening forming device configured to create an opening having a predefined geometry partially into a multilayer component at a selected location on a surface of the multilayer component, where the multilayer component includes a plurality of material layers including at least a substrate and a bond coat, and where the opening exposes each of the plurality of material layers; and an imaging device configured to create an image of the exposed plurality of material layers in the opening; and a processor configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening. Methods of using the system to analyze layer thickness of a multilayer component and repair a multilayer component are also provided.

The invention relates to a sensor device for examining the coating of a disc as part of a coating process. The sensor device comprises a first optical sensor system for determining the layer thickness of the coating applied to the disc, and comprises a rotation apparatus. The invention is characterized in that the first optical sensor system is designed to simultaneously identify at least one first position-based measured value and one second position-based measured value, the first and the second position-based measured value describing the distance between the sensor systems and the surface of the disc. As a result of this, the sensor system is configured such that the first position-based measured value of a coated region of the disc and the second position-based measured value of an uncoated region of the disc are identified. Furthermore, the first optical sensor system comprises at least one linear guide, which extends from the central region to the edge. In addition, a control and analysis apparatus is provided for calculating the layer thickness of the disc at the position of the first position-based measured value with the aid of the first and the second position-based measured value. Furthermore, the invention relates to a coating for a disc, comprising inspecting the coating for determining the layer thickness of the coating applied to the disc.

A test system for examining a hollow body, in particular a cylinder bore in an engine block, comprises a measuring apparatus comprising an elongate body and a plurality of sensors which are connected to the body and are set up to carry out a distance measurement. The test system also comprises electronic control means which are set up to move the measuring apparatus into a hollow body to be examined and to determine an internal diameter of the hollow body on the basis of distance measurement data from the sensors. In order to examine hollow bodies of different diameters, at least some of the sensors are in the form of movable sensors which can be moved relative to the elongate body of the measuring apparatus. The electronic control means are also set up to select a measuring position of the movable sensors relative to the elongate body on the basis of a hollow body to be examined. A calibration station is provided and the electronic control means are set up to carry out a calibration process for the movable sensors. A corresponding method is also disclosed.

Techniques, systems, and articles are described for preparing electrical cables for connections to a power grid. In one example, a system includes a handheld cable preparation device configured to cut one or more layers of an electrical cable and a computing device configured to control the cable preparation device to cut the one or more layers of the electrical cable.

A sensing system for measurement of a multilayered blown polymeric film. A feedblock supplies polymeric material streams to an annular blown film die to form a plurality of layers of different polymeric materials. A sensing system is positioned adjacent to a film bubble extruded from the blown film die, wherein the blown film bubble includes annular layers of at least two different polymeric materials. The sensing system emits a signal toward selected circumferential positions around the film bubble and receives a plurality of reflected signals at each circumferential position. Each reflected signal in the plurality of reflected signals is generated at an interface between annular layers that includes a refractive index change detectable by the sensing system. A processor processes the reflected signals from the sensing system, and for each circumferential position determines a layer thickness profile for each polymeric material in the film.

A substrate inspection system includes an imaging unit provided in a substrate processing apparatus and configured to acquire image data by imaging a surface of a substrate for color information on which a film is formed; a film thickness measurement unit provided in the substrate processing apparatus and configured to measure a film thickness of a substrate for film thickness measurement on which a film is formed under same conditions as on the substrate for color information; and a model creation unit configured to create a film thickness model corresponding to a correlation between information about color change on the surface of the substrate for color information caused by forming the film, which is acquired based on the image data, and the film thickness of the substrate for film thickness measurement, which is measured by the film thickness measurement unit.

An apparatus for transmitting and/or receiving terahertz, THz, radiation, comprising at least one terahertz element which is configured to generate and/or detect a THz signal, and at least one field-shaping element which in particular is assigned to the at least one terahertz element, wherein the at least one terahertz element is arranged in the region of a first surface of the field-shaping element.

In one aspect, there is provided a system including at least one processor; and at least one memory including program code which when executed by the at least one processor causes operations including capturing an image of at least a portion of a surface of an object; generating, from the captured image, pixel intensity data; in response to generating the pixel intensity data, determining, based on a height error model, height error data, wherein the height error data indicates an uncertainty of at least one height measurement of the object; and determining, based on the height error data, whether the object satisfies a threshold criteria for acceptance of the object. Related system, methods, and articles of manufacture are also disclosed.

A method of performing metrology analysis of a thin film includes coupling a radiation into an optical element disposed adjacent to a surface of the thin film. The radiation is coupled such that the radiation is totally internally reflected at an interface between the optical element and the thin film. An evanescent radiation generated at the interface penetrates the thin film. The method furthers include analyzing the evanescent radiation scattered by the thin film to obtain properties of the thin film.