A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

A vibrator device includes a vibrating body having a first surface, a package having a second surface opposed to the first surface of the vibrating body, a circuit board provided to the package so as to be opposed to the first surface of the vibrating body, a plurality of coupling electrodes provided to the first surface of the vibrating body, a first coupling line provided to the second surface of the package, a second coupling line provided to the circuit board, and a bonding material electrically coupling the coupling electrode and the first coupling line to each other, wherein the vibrating body has a protrusion protruding toward the package farther than the coupling electrode at the first surface side, and the protrusion has contact with the second surface of the package.

A vibrator device includes a vibrating body having a first surface, a package having a second surface opposed to the first surface of the vibrating body, a circuit board provided to the package so as to be opposed to the first surface of the vibrating body, a plurality of coupling electrodes provided to the first surface of the vibrating body, a first coupling line provided to the second surface of the package, a second coupling line provided to the circuit board, and a bonding material electrically coupling the coupling electrode and the first coupling line to each other, wherein the vibrating body has a protrusion protruding toward the package farther than the coupling electrode at the first surface side, and the protrusion has contact with the second surface of the package.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.