The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

An inertial measurement unit includes a sensor module including at least one inertial sensor and a printed substrate on which the inertia sensor is provided, and a lead group provided as a support member for supporting the printed substrate on an attachment surface, and leads of the lead group each have a first section coupled to the attachment surface, a second section extending from the first section toward the printed substrate in a direction that intersects the attachment surface, and a third section coupled to the printed substrate.

An anchor member supports a frame-shaped member. A first input electrode is located outside the frame-shaped member and separate from the frame-shaped member and fixed to a substrate. A second input electrode includes an electrode portion located outside the frame-shaped member and connected to the frame-shaped member. The second input electrode is displaceable in a prescribed direction. A first reference electrode is inside the frame-shaped member and fixed to the substrate. A second reference electrode includes an electrode portion located inside of the frame-shaped member and connected to the frame-shaped member. The second reference electrode is displaceable in the prescribed direction. In the structural component, the first input electrode and the electrode portion of the second input electrode are located between the frame-shaped member and a weight member in the prescribed direction in plan view in a thickness direction defined with respect to the substrate.

An anchor member supports a frame-shaped member. A first input electrode is located outside the frame-shaped member and separate from the frame-shaped member and fixed to a substrate. A second input electrode includes an electrode portion located outside the frame-shaped member and connected to the frame-shaped member. The second input electrode is displaceable in a prescribed direction. A first reference electrode is inside the frame-shaped member and fixed to the substrate. A second reference electrode includes an electrode portion located inside of the frame-shaped member and connected to the frame-shaped member. The second reference electrode is displaceable in the prescribed direction. In the structural component, the first input electrode and the electrode portion of the second input electrode are located between the frame-shaped member and a weight member in the prescribed direction in plan view in a thickness direction defined with respect to the substrate.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.

Couplers for selectively coupling in-plane and out-of-plane motion between moving masses are provided herein. In particular, aspects of the present application provide for a coupler configured to couple in-plane motion between moving masses while decoupling out-of-plane motion between the moving masses. The selective couplers as described herein may be used in a device, such as a microelectromechanical systems (MEMS) inertial sensor. In some embodiments, a MEMS inertial sensor comprises a first mass configured to move in-plane, a second mass configured to move in-plane and out-of-plane, and a coupler coupling the first and second masses and comprising two levers coupled to an anchor point by respective tethers and coupled to each other by a spring.

Couplers for selectively coupling in-plane and out-of-plane motion between moving masses are provided herein. In particular, aspects of the present application provide for a coupler configured to couple in-plane motion between moving masses while decoupling out-of-plane motion between the moving masses. The selective couplers as described herein may be used in a device, such as a microelectromechanical systems (MEMS) inertial sensor. In some embodiments, a MEMS inertial sensor comprises a first mass configured to move in-plane, a second mass configured to move in-plane and out-of-plane, and a coupler coupling the first and second masses and comprising two levers coupled to an anchor point by respective tethers and coupled to each other by a spring.