A monitoring and control system for a flow duct and a method for determining a component status of an operational component disposed within a flow passage of the flow duct utilizing the system are provided. In one exemplary aspect, the system includes at least two sensors that are disposed within the flow passage and configured to sense a characteristic of a fluid flowing therethrough. The sensors may be averaging sensors. Each sensor extends circumferentially about an axial centerline defined by the flow duct. The sensors are arranged in an overlapped arrangement. Particularly, the sensors extend circumferentially about the axial centerline such that the sensors physically overlap one another circumferentially. Additionally, the sensors may be disposed within the same or substantially the same plane axially. Signals generated by the sensors may be utilized to monitor and control the fluid and various operational components disposed within the flow passage.

A monitoring and control system for a flow duct and a method for determining a component status of an operational component disposed within a flow passage of the flow duct utilizing the system are provided. In one exemplary aspect, the system includes at least two sensors that are disposed within the flow passage and configured to sense a characteristic of a fluid flowing therethrough. The sensors may be averaging sensors. Each sensor extends circumferentially about an axial centerline defined by the flow duct. The sensors are arranged in an overlapped arrangement. Particularly, the sensors extend circumferentially about the axial centerline such that the sensors physically overlap one another circumferentially. Additionally, the sensors may be disposed within the same or substantially the same plane axially. Signals generated by the sensors may be utilized to monitor and control the fluid and various operational components disposed within the flow passage.

The present disclosure relates to a device for determining and/or monitoring at least one process variable of a medium including at least one sensor element and a unit at least partially including a material with anisotropic thermal conductivity. According to the present disclosure the unit is frictionally connected to the sensor element, and in particular the unit is frictionally fastened on a surface of the sensor element.

A thermoresistive gas sensor includes two identical, flat meshes that consist of a semiconductor material with a predetermined type of conductivity and that are interconnected in sections of an electric measuring bridge that are diametrically opposite one another, wherein each mesh of the two identical, flat meshes has mesh webs that extend parallel, adjacent to one another and that are connected electrically in parallel at the ends, where the mesh webs of the two meshes extend alternately adjacent to one another in a shared mesh plane horizontally across a window opening in a carrier plate.

A thermoresistive gas sensor includes two identical, flat meshes that consist of a semiconductor material with a predetermined type of conductivity and that are interconnected in sections of an electric measuring bridge that are diametrically opposite one another, wherein each mesh of the two identical, flat meshes has mesh webs that extend parallel, adjacent to one another and that are connected electrically in parallel at the ends, where the mesh webs of the two meshes extend alternately adjacent to one another in a shared mesh plane horizontally across a window opening in a carrier plate.

A sensor support portion supports a physical quantity sensor. A flow path housing portion forms a measurement flow path, which accommodates a support tip end portion of the sensor support portion. The sensor support portion includes a support front surface, which includes a front fixed portion away from the support tip end portion and fixed to an inner surface of the flow path housing portion. The physical quantity sensor includes a sensor exposure surface exposed from the support front surface. A separation distance between an end portion of the front fixed portion and an end portion of the sensor exposure surface is smaller than a separation distance between the end portion of the sensor exposure surface and the support tip end portion.

Disclosed is a thermal flow sensor including a base member and a cover. The base member includes a heater. The cover is formed by an SOI substrate including a silicon substrate, a silicon dioxide film, and a silicon film. The silicon film has a recessed portion defined therein. A main flow passage portion is defined by an exposed surface of the silicon dioxide film which is exposed from the silicon film and which defines a bottom surface of the recessed portion, the silicon film defining a side surface of the recessed portion, and a first principal surface of the cover.

A unit for high-temperature for uses above 700° C. is provided. The unit includes a housing and an electrical functional element. The functional element has a non-conducting substrate, an electrically conductive element, and at least one connection wire or pad. The functional element has a first section, a second section, and a third section. The first section is within the housing and shielded from a local environment. The second section includes the at least one connection wire or pad and is accessible externally to the housing. The third section is between the first and second sections and is embedded in an electrically insulating material. The insulating material seals off the housing from the functional element. A physical and/or chemical bond at an interface between the insulating material and the functional element.

Provided is a physical quantity detection device that can improve physical quantity measurement accuracy over a conventional device. A physical quantity detection device 20 includes a detector including a flow rate detection unit 205, a circuit board 207, a housing 201, and a cover 202. The detector detects a physical quantity and is mounted on the circuit board 207. The housing 201 houses the circuit board 207. The cover 202 is fixed to the housing 201 and defines an auxiliary passage 234 in which the flow rate detection unit 205 is disposed. The housing 201 and the cover 202 include a positioning portion P that includes a pin P1 extending in a thickness direction Dt of the circuit board 207 and a fitting portion P2 into which an end portion P11 of the pin P1 is fitted for positioning between the housing 201 and the cover 202. The pin P1 includes an engagement portion P12 that faces an engagement surface 207f of the circuit board 207 along the thickness direction Dt and restricts movement of the circuit board 207 in a surface direction Df along the front and rear surfaces thereof.

The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.