G01K2007/422

Furnace for relieving stress from glass products

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

Temperature monitoring device, temperature monitoring method, and composite material manufacturing method

This temperature monitoring device (100) can be placed in a furnace together with a composite material. The temperature monitoring device (100) includes: a pair of internal components (10) that each have a temperature detection surface (11) and are layered such that the temperature detection surfaces (11, 11) face each other; a temperature detection unit (30) disposed so as to be sandwiched between the temperature detection surfaces (11, 11); at least a pair of external components (20) that are respectively disposed on reverse sides from the temperature detection surfaces (11); and an adjustment part (50) capable of adjusting the sizes of the thickness-direction gaps between the internal components (10) and external components (20).

TEMPERATURE CALIBRATION SHEETS AND APPLICATION METHODS THEREOF
20220319884 · 2022-10-06 · ·

A temperature calibration sheet includes a main body and a plurality of test keys arranged in the main body. The test keys have voltage-temperature characteristic curves corresponding to a set current. Temperatures of the test keys are obtained by detecting voltages of the test keys. The temperature calibration sheet can simulate a state of a wafer, sidewalls of the test keys are not exposed to the air, and the state of the temperature calibration sheet arranged on a semiconductor machine is the same as that of the wafer arranged on the semiconductor machine, such that the temperature of the temperature calibration sheet can truly reflect the temperature of the wafer when arranged on the semiconductor machine, and the temperature of the semiconductor machine can be calibrated accurately.

TEMPERATURE MEASUREMENT UNIT, HEAT TREATMENT APPARATUS, AND TEMPERATURE MEASUREMENT METHOD
20220051913 · 2022-02-17 ·

A temperature measurement unit includes a measurement substrate on which a sensor configured to measure a temperature is mounted, an information processor configured to acquire a result of detection by the sensor, and a cable connecting the sensor and the information processor to each other. The information processor is configured to be detachably installed on an installation part facing a heating area provided with a hot plate, with a cooling area interposed therebetween. The cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area and the measurement substrate is placed on the hot plate in a state in which the information processor is installed on the installation part.

METHOD OF MEASURING A TEMPERATURE OF A HEAT PLATE AND METHOD THEREOF
20170234737 · 2017-08-17 ·

A device that measures a temperature of a heat plate for heating a target substrate mounted thereon, includes: a temperature measurement substrate including a substrate body and temperature sensors installed in the substrate body; a memory part to store correction parameters over a plurality of time zones after the temperature measurement substrate is mounted on the heat plate; and a data processing part configured to acquire time transition data of a temperature by correcting respective temperature detection values sampled at predetermined time intervals after the temperature measurement substrate is mounted on the heat plate, using the correction parameters stored in the memory part in a corresponding relationship with the temperature sensors and the time zones. The correction parameters are obtained in advance based on a standard temperature transition data acquired in advance using the temperature sensors and a time transition data acquired by each of the temperature sensors.

Thermally determining flow and/or heat load distribution in parallel paths

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

Dummy for Monitoring the Molding Process
20210381910 · 2021-12-09 ·

Test dummy for detecting at least one process variable in the manufacture of glassware of identical or similar design along a production line, comprising a base body which is adapted to the shape and/or dimension of the glassware in such a manner that it can pass through the production line instead of a glassware, at least one sensor system mounted on the base body for detecting the at least one process variable on the base body, and at least one transmission apparatus mounted on the base body for transmitting the at least one detected process variable to a digital receiving unit.

Apparatus and method for emulating temperature during a thermal cure cycle

A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.

Blast gel pack conditioning equipment

Automated blast gel pack conditioning equipment is provided and includes a housing with an evaporator and heater and defining a void space for containing a set of gel packs, at least one fan for circulating air within the housing such that a path of air flow extends through an air insufflation end to an air return end within the housing, at least one temperature sensor located within the housing, and a controller for receiving temperature measurements from the at least one temperature sensor and for automatically controlling operation of the evaporator, heater, and fans during phase change processing and conditioning of gel packs. A method of phase change processing and conditioning gel packs and a temperature sensor assembly are also provided.

Electron beam treatment for invasive pests
11639010 · 2023-05-02 · ·

A system and method for the treatment of invasive pests includes an irradiation device that can generate an electron beam that is applicable to a tree infected by an invasive pest, wherein the electron beam provides an in-situ treatment for the tree infected by the invasive pest by killing the invasive pest via electron beam irradiation. One or more temperature sensors can be used to track the internal temperature of a tree surrogate. A differential temperature difference tracked by temperature sensor can be used to ensure that a reduction in temperature of the tree is attributable to the electron beam rather than increase in heat.