A safety device for a switch includes a casing, a top cover, a conductive plate, a first terminal, a second terminal, a pushing member and a connection member. The first terminal has a first end in connection with a fixed end of the conductive plate. The second terminal has a first end with a second contact point corresponding to a first contact point on a free end of the conductive plate. The pushing member is disposed between the first terminal and the second terminal. A gap is defined between the pushing member and the conductive plate. The connection member is in connection with the top cover and the free end of the conductive plate. Therefore, the pushing member can effectively push and force the deformed conductive plate after overheating to trip off completely, so that a circuit is cut off, thereby achieving the purpose of protection of the switch.

A safety device for a switch includes a casing, a top cover, a conductive plate, a first terminal, a second terminal, a pushing member and a connection member. The first terminal has a first end in connection with a fixed end of the conductive plate. The second terminal has a first end with a second contact point corresponding to a first contact point on a free end of the conductive plate. The pushing member is disposed between the first terminal and the second terminal. A gap is defined between the pushing member and the conductive plate. The connection member is in connection with the top cover and the free end of the conductive plate. Therefore, the pushing member can effectively push and force the deformed conductive plate after overheating to trip off completely, so that a circuit is cut off, thereby achieving the purpose of protection of the switch.

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).