A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.

A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.

The inventive concepts provide a temperature controller for performing a comparative measurement process and a sensing calibration process without separating a temperature sensor and an input channel, if a comparative measurement process and a sensing calibration process of a temperature sensor for controlling a temperature of a semiconductor manufacturing facility are performed.

The inventive concepts provide a temperature controller for performing a comparative measurement process and a sensing calibration process without separating a temperature sensor and an input channel, if a comparative measurement process and a sensing calibration process of a temperature sensor for controlling a temperature of a semiconductor manufacturing facility are performed.

A temperature drift compensation method includes pre-aging a thermocouple, during which the thermocouple is subjected to temperatures and/or pressures that cause or facilitate an oxidation growth on the conductor elements of the thermocouple. During the pre-aging, temperature readings of the thermocouple are recorded, and a model including a time-based exponential expression is derived from the temperature readings. In addition, a temperature sensor system includes a pre-aged thermocouple, and a temperature compensation circuit that modifies initial temperature readings from the pre-aged thermocouple according to a model including a time-based exponential expression.

This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

Representative implementations of devices and techniques provide calibration for a chip-based temperature sensor. Two or more measurements are taken using a high resolution temperature sensor digitizer, and used to determine a calibration for the temperature sensor, based on a reference temperature value calculated from the measurements.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.