A semiconductor device includes a temperature-independent current generator that generates a reference current substantially independent of temperature and a mirror current that is a substantial duplicate of the reference current, a pulse signal generator that samples the mirror current so as to generate a pulse signal, and a counter that obtains a number of pulse signals generated by the pulse signal generator, that permits the pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and that inhibits the pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value. A method for monitoring a temperature of the semiconductor device is also disclosed.

A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, or a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

A wireless adapter (10) is removably connected to an electronic device (30) to provide wireless connectivity for the electronic device (30). One or more operating parameters of the wireless adapter (10) are measured whilst the wireless adapter (10) is in use. A measure of the temperature of the wireless adapter (10) is obtained based on the measured one or more operating parameters.

A semiconductor package includes a first set of leads, a temperature sensor proximate the first set of leads, a second set of leads, a semiconductor die, a first electrical connection between the temperature sensor and the semiconductor die, a second electrical connection between the semiconductor die and the second set of leads, and mold compound at least partially covering the temperature sensor, the semiconductor die, the first set of leads and the second set of leads. The mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.

A digital sensor network is overlaid on an integrated circuit for identifying and mapping hotspots in the integrated circuit. The digital sensor network may include a plurality of digital sensors distributed within an area of an integrated circuit component of an integrated circuit. Each of the plurality of digital sensors may include a ring oscillator and may be configured to output a counter value of a ring oscillator counted over a designated period. A sensor network control unit may be provided that is communicatively connected to the plurality of digital sensors via a communication circuit. The sensor network control unit may be configured to receive a plurality of counter values including the counter value from each of the plurality of digital sensors and identify a hotspot within the area of the integrated circuit.

An information processing apparatus includes a fan that cools a first processor, a dust-proof bezel that prevents dust from entering a casing, a memory, and a second processor coupled to the memory. The second processor is configured to measure a temperature of the first processor and an air volume of an air flow which passes through the dust-proof bezel, compare a registered air volume to the measured air volume when the temperature matches a registered temperature included in comparison information stored in the memory. The registered air volume being included in the comparison information in association with the matched temperature and the comparison information including a registered temperature of the first processor and a registered air volume of an air flow generated by the fan in association with each other. The second processor determines an abnormality in the dust-proof bezel based on a comparison result.

A temperature sensing device for a temperature-based tamper detection system includes an integrated circuit (IC) and a logic circuit. The logic circuit sends an enable signal to the IC, causing it to measure the device temperature, and initiates a security timer. In response to not receiving the device temperature before the security timer expires, the logic circuit outputs a tamper event signal and an error code. The logic circuit can disable the enable signal in response to not receiving the device temperature before the timer expires. In some implementations, the logic circuit is a first logic circuit, and the IC includes an analog integrated circuit (AIC) and a second logic circuit. The second logic circuit receives the enable signal from the first logic circuit, causes the AIC to measure the device temperature, and outputs a ready signal and the device temperature to the first logic circuit.

Embodiments of the disclosure disclose a method and an apparatus for implementing a virtual sensor (for example, a virtual thermistor) for checking temperature (or heating) of an electronic device by the electronic device. An electronic device according to various embodiments includes a plurality of electronic components mounted into the electronic device, and a processor operatively connected to the electronic components, wherein the processor is configured to classify a prediction area according to predetermined characteristics, configure a virtual thermistor corresponding to the prediction area, based on the classification characteristic of the prediction area, collect information on at least one prediction area, based on the virtual thermistor, and manage heating of the electronic device, based on the collected information. Various embodiments are possible.

A short circuit detection circuit includes a current terminal, a sense resistor, an amplifier, and a resistor-capacitor ladder. The sense resistor is coupled to the current terminal, and is configured to develop a sense voltage proportional to a current through the current terminal. The amplifier is coupled to the sense resistor, and is configured to generate a scaled current proportional to the sense voltage. The resistor-capacitor ladder is coupled to the amplifier, and is configured to generate a measurement voltage that represents a surface temperature rise due to the current through the current terminal.

A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.