A simultaneous location and mapping (SLAM)-enabled video game system, a user device of the video game system, and a computer-readable storage medium of the user device are disclosed. Generally, the video game system includes a video game console, a plurality of thermal beacons, and a user device communicatively coupled with the video game console. The user device includes a thermopile array, a processor, and a memory. The user device may receive thermal data from the thermopile array, the thermal data corresponding to a thermal signal emitted from a thermal beacon of the plurality of thermal beacons and detected by the thermopile array. The user device may determine, based on the thermal data, its location in 3D space, and then transmit that location to the video game system.

Systems and methods of body temperature measurement obtain a first temperature from a first temperature sensor. The first temperature sensor is separated from a second temperature sensor by a first insulator. A second temperature is obtained from the second temperature sensor. A heat transfer rate between the first temperature and the second temperature sensor is calculated and a body temperature determined from the heat transfer rate.

The present disclosure relates to a method for estimating parameters of a junction of a power semi-conductor element comprising: •—Detecting at least one stable on-line operating condition through measurements (2, 3, 4) of Von, Ion, Tc on a semi-conductor module (1) where Ion is a current for which the on-state voltage Von of the semi-conductor is sensitive to the temperature and Tc is the temperature of the casing of said semi-conductor element; •—Measuring and storing at least one parameter set Von, Ion, Tc of said at least one stable operating condition; •—in a calculating unit (52), providing calculations for minimizing the error between a junction temperature estimation Tj of an electrical model Tj=F(Von, Ion, θelec) comprising a first set of unknown parameters θelec and another junction temperature estimation Tjmod of a loss/thermal model Tj=G(lon, Tc, θ mod) comprising a second set of unknown parameters θ mod and obtaining at least one set of parameters θelec and at least one parameter θ mod providing minimization of said error; •—providing the calculated value of Tj with at least one of the calculated parameters sets θelec and/or θ mod and the measured Von, Ion, Tc; •—Storing the at least one parameters set θelec and/or θ mod and/or Tj.

The application provides a temperature calibration method, including: under a condition that first temperature data of a temperature sensor and second temperature data of a temperature controller meet a temperature equilibrium condition, calibrating real-time temperature data of the temperature controller; and under a condition that the first temperature data and the second temperature data do not meet the temperature equilibrium condition, determining a temperature calibration constant value according to third temperature data of the temperature sensor and fourth temperature data of the temperature controller when temperature control is not performed and performing temperature calibration, by using a temperature calibration formula including the temperature calibration constant value, on the real-time temperature data obtained by the temperature controller. The application can solve the problem of insufficient accuracy of the temperature measured. The application further provides a temperature calibration system, and an electronic device, which have the beneficial effects.

A system and method includes at least one temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement at a first location of an operational device, which first location is in thermal contact with a second location of the operational device. The processing unit selects a simulated temperature distribution of the first location of a simulated device from a plurality of simulated temperature distributions of the first location and compares the temperature measurement with simulated temperature distributions of the first location, and determines whether a hot spot exists or is developing at the second location. The determination comprises utilization of a correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device.

An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.

A method for open-loop and/or closed-loop control of a heating of a cast or rolled metal product, includes the steps of determining the total enthalpy of the metal product from a sum of the free molar enthalpies (Gibbs energy) of all phases and/or phase fractions currently present in the metal product; determining a temperature distribution within the metal product by means of a dynamic temperature calculation model using the total enthalpy determined; and open-loop and/or closed-loop controlling of the heating of the metal product as a function of at least one output variable of the temperature calculation model.

A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.

A food thermometer includes a resistance thermometer with an electrical conductor and at least three measuring points for the electrical conductor.

A digital sensor network is overlaid on an integrated circuit for identifying and mapping hotspots in the integrated circuit. The digital sensor network may include a plurality of digital sensors distributed within an area of an integrated circuit component of an integrated circuit. Each of the plurality of digital sensors may include a ring oscillator and may be configured to output a counter value of a ring oscillator counted over a designated period. A sensor network control unit may be provided that is communicatively connected to the plurality of digital sensors via a communication circuit. The sensor network control unit may be configured to receive a plurality of counter values including the counter value from each of the plurality of digital sensors and identify a hotspot within the area of the integrated circuit.