G01L2009/0066

PRESSURE TRANSDUCER AND METHOD FOR FABRICATING THE SAME

A pressure transducer comprises a housing including a body section and at least one end cap at one end of the body section, which are made of piezoelectric crystal, and a piezoelectric resonator in the housing. The body section and the end cap are bonded by an atomic diffusion bonding method.

PRESSURE SENSING DEVICE HAVING TEMPERATURE SENSOR

Disclosed is a pressure detecting device having a temperature sensor, the device including: a housing having a first chamber, a second chamber, and a port part having a fluid guide tube that guides a pressure transmitting fluid to the second chamber; a lead frame coupled to the housing and configured for being connected to an external device; a circuit substrate electrically connected to the lead frame and including a first surface and a second surface; a pressure detecting element provided on the second surface of the circuit substrate and generating an electrical signal according to a pressure change; a tube coupled to the port part, whereby a first end of the tube is open and provided inside the first chamber; and a temperature detecting element provided inside the tube and transmitting an electrical signal generated according to a temperature change to the circuit substrate.

Fully-passive pressure sensors and methods for their use

Fully-passive sensor systems that receive an input electromagnetic signal and return an output electromagnetic signal are described. The sensor systems can be used to measure pressure in biological or non-biological systems.

PRESSURE MEASURING CELL
20220268655 · 2022-08-25 ·

The invention relates to a pressure measuring cell with a base body including an internal space, which base body comprises a first opening. A pressure sensor is arranged in the internal space of the base body and the internal space is filled with a pressure transfer medium. The pressure measuring cell further comprises an uneven membrane made from plastic. The membrane fully covers the first opening of the base body and is metallically coated at least on one of its two sides.

FULLY-PASSIVE PRESSURE SENSORS AND METHODS FOR THEIR USE
20200309612 · 2020-10-01 ·

Fully-passive sensor systems that receive an input electromagnetic signal and return an output electromagnetic signal are described. The sensor systems can be used to measure pressure in biological or non-biological systems.

PRESSURE DETECTION DEVICE AND MANUFACTURING METHOD
20240011856 · 2024-01-11 ·

Provided is a pressure detection device including: a semiconductor substrate having an upper surface; a bulk region of a first conductivity type provided in the semiconductor substrate; a piezo-resistive region of the first conductivity type provided between the bulk region and the upper surface of the semiconductor substrate; a first well region of a second conductivity type provided between the piezo-resistive region and the bulk region; and a first low-concentration region of the second conductivity type provided between the first well region and the bulk region and having a lower concentration than the first well region.

Pressure Sensor on a Ceramic Substrate

A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing comprising a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
20200095115 · 2020-03-26 ·

A semiconductor device includes a first substrate having a first surface, and a second substrate having a second surface. A part of the second substrate is bonded to a part of the first surface with atmospheric pressure plasma. The semiconductor device further includes an oxide film disposed on the first surface of the first substrate, and a protection film layered on a surface of the oxide film opposite to the first substrate.

Overforce control through sense die design

A sense die comprises a chip comprising a sense diaphragm, one or more sense elements supported by the diaphragm, one or more bond pads supported by a first side of the chip, a structural frame disposed on the first side of the chip, and one or more electrical contacts extending through the structural frame. Each of the one or more bond pads is electrically coupled to at least one of the one or more sense elements. The structural frame is disposed at least partially about the diaphragm, and the one or more electrical contacts are electrically coupled to the one or more bond pads.

Pressure transducer and method for fabricating the same

A pressure transducer comprises a housing including a body section and at least one end cap at one end of the body section, which are made of piezoelectric crystal, and a piezoelectric resonator in the housing. The body section and the end cap are bonded by an atomic diffusion bonding method.