A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.

To suppress variations in the shift amount of the zero point of a sensor output when a pipe is connected to a pressure sensor via a clamp. A pressure sensor includes two semiconductor chips in two straight lines, orthogonal to each other, that pass through a center of a diaphragm in plan view, two resistors in the region between two supporting members supporting one semiconductor chip, and two other resistors in the region between two other supporting members supporting the other semiconductor chip.

A sensor membrane structure is provided. The sensor membrane structure includes a substrate, a first insulating layer, and a device layer. The substrate has a first surface and a second surface that is opposite to the first surface. A cavity is formed on the first surface, an opening is formed on the second surface, and the cavity communicates with the opening. The cavity and the opening penetrate the substrate in a direction that is perpendicular to the first surface. The first insulating layer is disposed on the first surface of the substrate. The device layer is disposed on the first insulating layer. The first insulating layer is disposed for protecting the sensor membrane structure from overetched and remain stable during the etching process, increasing the yield of the sensor membrane structure.

The invention relates to pressure sensors having a membrane having sensor chips having measuring bridges having sensor elements, wherein the membrane is fastened in a housing, with a carrier or as part of a housing, to which membrane a working medium can be applied. The pressure sensors are characterised in particular in that the mechanical stresses resulting from a fastening and/or an installation of the pressure sensors do not influence the measurement result and/or the measurement signal. To this end, at least two sensor chips, which are spaced apart from one another and are offset at an angle to one another, are located at least on a side of the membrane that bends on application of pressure. The measuring bridges are designed and/or connected to a controller in such a manner that at least one force resulting from the fastening of the membrane and thus acting on the membrane is or will be compensated.

A fluid-dynamic device with integrated sensor element includes a first chamber suitable for the containment and/or the passage of a fluid, provided with an inlet opening operatively connectable to a fluid-dynamic circuit and configured to allow a fluid to enter the first chamber, and with a separate outlet opening, operatively connectable to a fluid-dynamic circuit and configured to expel said fluid from the first chamber. The first chamber includes at least one portion elastically deformable due to the action of the fluid contained therein and/or passing through the first chamber, to which a sensor element is associated which is sensitive to the deformation of the elastically deformable portion of the first chamber.

Provided is a flight control apparatus including a pair of sensors that are spaced apart in a vertical direction on a surface of a flying object which uses motive power of a power source powered by a battery to fly and that detect a physical quantity corresponding to a state of an airflow, and a control unit that controls a flight state of the flying object on the basis of a difference between outputs of the pair of sensors.

Disclosed is a pressure sensing element that is formed using a semiconductor substrate, the pressure sensing element including: a frame; a diaphragm that is supported by the frame; and a piezoresistor that is arranged on the diaphragm. The diaphragm includes a trench and a plurality of beams, the beams are arranged such that the beams connect a portion around an edge of the diaphragm to a portion around a center of the diaphragm and the beams cross each other in the portion around the center of the diaphragm, and a beam that is each of the beams includes a narrow portion that has a first width and a wide portion that has a second width wider than the first width.

A sensor including a deformation body having a membrane for deformation when subjected to pressure from a medium. The sensor further includes a strain element applied to and attached to the membrane. The strain element is based on SOI technology and has multiple piezoresistive resistors.

Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

A sensor for detecting the pressure of a fluid has a sensor body having at least one first body part and one second body part. The first body part and the second body part are joined together in such a way that a first face of the first body part faces a first face of the second body part, at a distance therefrom.

The pressure sensor has a circuit arrangement, which includes at least one first electrical circuit that extends at least in part in an area corresponding to a membrane portion and is configured for detecting an elastic flexure or deformation thereof.

The first electrical circuit is associated to the first face of one of the first body part and the second body part, and the first face of the other one of the first body part and the second body part forms or has associated thereto at least one circuit element, prearranged for interacting with the first electrical circuit when an elastic flexure or deformation of the membrane portion is of a degree at least equal to a substantially predetermined limit, to generate thereby information or a warning representative of at least one from among an excessive pressure of the fluid, an incorrect pressure measurement, and an anomalous state of the device.