A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.

A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.

(Object) To reduce the power consumption. (Means of Achieving the object) A sensor element according to an aspect of the present invention is used in a sensor system, the sensor system including at least one of a detector and a calculator, and a power source, the sensor element including a charge generation element configured to generate a charge in response to an external stimulus; and a signal converter configured to convert the charge into a predetermined output signal, wherein the signal converter is formed of one or more passive elements only, and an initial driving power for the signal converter is supplied from the power source.

In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

Pressure sensors are configured for accurate, non-position sensitive pressure measurement. They can offer microprocessor-based features for optimized measurement, control, and signaling using precision-calibrated silicon piezoresistive microelectromechanical (MEMS) sensors provisioned within a durable, versatilely mountable housing. Such sensors can be mounted readily in alternate locations, configurations, and/or positions. They can also offer real-time temperature compensation, enable selectable analog outputs (such as 2-wire mA, 3-wire mA, or 3-wire V signals), enable adjustable range or subrange selection, support uni- or bi-directional settings, and allow local (pushbutton) or remote (via dry contacts) zeroing for accuracy.

Pressure sensors are configured for accurate, non-position sensitive pressure measurement. They can offer microprocessor-based features for optimized measurement, control, and signaling using precision-calibrated silicon piezoresistive microelectromechanical (MEMS) sensors provisioned within a durable, versatilely mountable housing. Such sensors can be mounted readily in alternate locations, configurations, and/or positions. They can also offer real-time temperature compensation, enable selectable analog outputs (such as 2-wire mA, 3-wire mA, or 3-wire V signals), enable adjustable range or subrange selection, support uni- or bi-directional settings, and allow local (pushbutton) or remote (via dry contacts) zeroing for accuracy.

A sensor is disclosed which includes a piezoelectric layer, a piezoresistive layer, one or more electrode layers coupled to the piezoelectric layer and to the piezoresistive layer, the piezoelectric layer configured to provide an electrical signal in response to application of a dynamic disturbance, and the piezoresistive layer configured to provide a change in resistivity in response to application of a static disturbance.

A sensor is disclosed which includes a piezoelectric layer, a piezoresistive layer, one or more electrode layers coupled to the piezoelectric layer and to the piezoresistive layer, the piezoelectric layer configured to provide an electrical signal in response to application of a dynamic disturbance, and the piezoresistive layer configured to provide a change in resistivity in response to application of a static disturbance.

A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.