Systems and methods for analysis of a whole blood sample from an individual to determine the platelet function and coagulation status of the individual in a substantially automated and efficient matter. Also provided here are systems, reagent kits, and methods for concurrent assessment of platelet function and coagulation as they interact during hemostasis.

An apparatus includes a measurement chamber configured to retain one or more sample substances. The apparatus includes an entrance window mounted on a side of the measurement chamber. The apparatus includes a light source configured to generate an incident light beam. The apparatus includes a Raman sensor configured to collect inelastically scattered light from the chamber, and measure an intensity of a Raman peak of a first substance from the one or more sample substances based on the collected inelastically scattered light. The apparatus further includes a processor configured to (i) calculate a concentration of the first substance based on at least the measured intensity of the Raman peak of the first substance, (ii) determine the end point of a wafer cleaning process based on a calculated concentration of the first substance, and (iii) terminate the wafer cleaning process based on the determined end point.

A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.

Methods, apparatus, and systems are provided herein for processing a substrate. Generally, the processing involves Spacer-on-Spacer (SoS) Self-Aligned Quadruple Patterning (SAQP) techniques. The disclosed techniques provide a novel process flow that reduces defects by ensuring that cores are not removed from the substrate until the substrate is transferred to a deposition chamber used to deposit a second spacer layer. This reduces or eliminates the risk of structural damage to features on the substrate while the substrate is being transferred or cleaned. Such structural damage is common when the cores are removed from the substrate prior to cleaning and transfer.

An apparatus includes a measurement chamber configured to retain one or more sample substances. The apparatus includes an entrance window mounted on a side of the measurement chamber. The apparatus includes a light source configured to generate an incident light beam. The apparatus includes a Raman sensor configured to collect inelastically scattered light from the chamber, and measure an intensity of a Raman peak of a first substance from the one or more sample substances based on the collected inelastically scattered light. The apparatus further includes a processor configured to (i) calculate a concentration of the first substance based on at least the measured intensity of the Raman peak of the first substance, (ii) determine the end point of a wafer cleaning process based on a calculated concentration of the first substance, and (iii) terminate the wafer cleaning process based on the determined end point.

In some implementations, a device may identify, based on spectroscopic data, a pseudo steady state end point indicating an end of a pseudo steady state associated with the blending process. The device may identify a reference block and a test block from the spectroscopic data based on the pseudo steady state end point. The device may generate a raw detection signal associated with the reference block and a raw detection signal associated with the test block. The device may generate a statistical detection signal based on the raw detection signal associated with the reference block and the raw detection signal associated with the test block. The device may determine whether the blending process has reached a steady state based on the statistical detection signal.

A device may receive spectroscopic data associated with a dynamic process. The device may identify a pseudo steady state end point based on the spectroscopic data. The pseudo steady state end point may indicate an end of a pseudo steady state associated with the dynamic process. The device may identify a reference block and a test block based on the pseudo steady state end point, and may generate a raw detection signal associated with the reference block and a raw detection signal associated with the test block. The device may generate an averaged statistical detection signal based on the raw detection signal associated with the reference block and the raw detection signal associated with the test block, and may determine whether the dynamic process has reached a steady state based on the averaged statistical detection signal.

A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.

In an example implementation, a sintering system includes optical fiber installed into a sintering furnace. A support structure inside the furnace is to support a token green object in a predetermined position and to hold a distal end of the fiber adjacent to the predetermined position. A light source is operably engaged at a proximal end of the fiber to transmit light through the fiber into the furnace. A light detector is operably engaged at the proximal end of the fiber to receive reflected light through the fiber that scatters off a surface of the token green object.

Embodiments of the present disclosure generally relate to methods for detecting end-points of cleaning processes for aerospace components containing corrosion. The method includes exposing the aerospace component to a first solvent, exposing the aerospace component to a first water rinse, and analyzing a first aliquot of the first water rinse by absorbance spectroscopy to determine an intermediate solute concentration in the first aliquot, where the intermediate solute concentration is greater than a reference solute concentration. The method further includes exposing the aerospace component to an aqueous cleaning solution to remove corrosion from the aluminum oxide layer, exposing the aerospace component to a second solvent, and exposing the aerospace component to a second water rinse, and analyzing a second aliquot of the second water rinse by absorbance spectroscopy to determine a post-clean solute concentration in the second aliquot, where the post-clean solute concentration is less than the intermediate solute concentration.