An object of the present invention is to improve the accuracy of clustering by avoiding detection of false clusters when automatically clustering points on a scatter diagram. A surface analyzer according to a first aspect of the present invention includes a measurement unit (1-2, 4-8) configured to acquire a signal reflecting a quantity of a plurality of components or elements that are analysis targets at a plurality of positions on a sample (3), a scatter diagram generation unit (92) configured to generate a binary scatter diagram based on a measurement result by the measurement unit, a clustering unit (94) configured to perform clustering of points in the binary scatter diagram using a method of a density-based clustering, and a parameter adjustment unit (93) configured to adjust a distance threshold by utilizing distribution information on a signal value of the components or the elements on either axis in the binary scatter diagram, the distance threshold being one of parameters to be set in the density-based clustering.

The present invention relates to a method for acquiring tomographic images of a sample in a microscopy system, wherein the sample comprises a defined region, and wherein the method comprises determining a location in three-dimensional space of the defined region, wherein the method further comprises capturing an image of at least a part of the sample, and wherein the determination of the location in three-dimensional space of the defined region is based, at least in part, on the image of the part of the sample. The present invention also relates to a corresponding microscopy system and a computer program product to perform the method according to the present invention.

A vacuum connection mechanism includes: a main body part having a first opening and a first sub opening opened symmetrically in a first direction, and a second opening and a second sub opening opened symmetrically in a second direction; a first bellows connected to the first opening and to the end of which a first flange is provided; a first sub bellows connected to the first sub opening and to the end of which a first blind flange is provided; a first supporting member coupling the first flange and the first blind flange; a second bellows connected to the second opening and to the end of which a second flange is provided; a second sub bellows connected to the second sub opening and to the end of which a second blind flange is provided; and a second supporting member coupling the second flange and the second blind flange.

A vacuum connection mechanism includes: a main body part having a first opening and a first sub opening opened symmetrically in a first direction, and a second opening and a second sub opening opened symmetrically in a second direction; a first bellows connected to the first opening and to the end of which a first flange is provided; a first sub bellows connected to the first sub opening and to the end of which a first blind flange is provided; a first supporting member coupling the first flange and the first blind flange; a second bellows connected to the second opening and to the end of which a second flange is provided; a second sub bellows connected to the second sub opening and to the end of which a second blind flange is provided; and a second supporting member coupling the second flange and the second blind flange.

Imaging technology using high energy charged particles can be used to image an object of inspection such as a blast furnace. An example method of imaging a blast furnace includes performing a first moving operation by moving a first particle tracking detector and a second particle tracking detector up or down movement along a height of the blast furnace; performing a second moving operation by moving the first particle tracking detector and the second particle tracking detector clockwise or counterclockwise movement around the blast furnace; and receiving, by the first particle tracking detector, incoming charged particles; receiving, by the second particle tracking detector, outgoing charged particles transiting through the blast furnace; and producing an image of a volume of interest located in between the first particle tracking detector and the second particle tracking detector by processing electrical signals corresponding to the received incoming and outgoing charged particles.

Imaging technology using high energy charged particles can be used to image an object of inspection such as a blast furnace. An example method of imaging a blast furnace includes performing a first moving operation by moving a first particle tracking detector and a second particle tracking detector up or down movement along a height of the blast furnace; performing a second moving operation by moving the first particle tracking detector and the second particle tracking detector clockwise or counterclockwise movement around the blast furnace; and receiving, by the first particle tracking detector, incoming charged particles; receiving, by the second particle tracking detector, outgoing charged particles transiting through the blast furnace; and producing an image of a volume of interest located in between the first particle tracking detector and the second particle tracking detector by processing electrical signals corresponding to the received incoming and outgoing charged particles.

A multiple secondary electron beam alignment method includes scanning a plurality of first detection elements of a multi-detector, which are arrayed in a grid, with multiple secondary electron beams emitted from a surface of a target object on a stage, detecting a plurality of beams including a corner beam located at a corner in the multiple secondary electron beams by the multi-detector, calculating a positional relationship between the plurality of beams including the corner beam and a plurality of second detection elements, which have detected the plurality of beams including the corner beam, in the plurality of first detection elements, calculating, based on the positional relationship, a shift amount for aligning the plurality of first detection elements with the multiple secondary electron beams, and moving, using the shift amount, the multi-detector relatively to the multiple secondary electron beams.

A multiple secondary electron beam alignment method includes scanning a plurality of first detection elements of a multi-detector, which are arrayed in a grid, with multiple secondary electron beams emitted from a surface of a target object on a stage, detecting a plurality of beams including a corner beam located at a corner in the multiple secondary electron beams by the multi-detector, calculating a positional relationship between the plurality of beams including the corner beam and a plurality of second detection elements, which have detected the plurality of beams including the corner beam, in the plurality of first detection elements, calculating, based on the positional relationship, a shift amount for aligning the plurality of first detection elements with the multiple secondary electron beams, and moving, using the shift amount, the multi-detector relatively to the multiple secondary electron beams.

An improved charged particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved alignment mechanism is disclosed. An improved charged particle beam inspection apparatus may include a second electron detection device to generate one or more images of one or more beam spots of the plurality of secondary electron beams during the alignment mode. The beam spot image may be used to determine the alignment characteristics of one or more of the plurality of secondary electron beams and adjust a configuration of a secondary electron projection system.

An improved charged particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved alignment mechanism is disclosed. An improved charged particle beam inspection apparatus may include a second electron detection device to generate one or more images of one or more beam spots of the plurality of secondary electron beams during the alignment mode. The beam spot image may be used to determine the alignment characteristics of one or more of the plurality of secondary electron beams and adjust a configuration of a secondary electron projection system.