An inertial sensor, includes: a substrate; a fixing portion that is provided on the substrate; a first movable body that faces the substrate and that is displaceable with a first support beam as a first rotation axis; the first support beam that is arranged in a first direction and that couples the first movable body and the fixing portion; a second movable body that is displaceable due to deformation of a second support beam; the second support beam that is arranged in a second direction intersecting the first direction and that couples the first movable body and the second movable body; and a protrusion that is provided on the substrate or the second movable body, overlaps the second movable body in plan view from a third direction and that protrudes toward the second movable body or the substrate.

A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.

Provided is an acceleration sensor capable of realizing a simultaneous operation method of signal detection and servo control in place of a time-division processing method, by an MEMS process in which a manufacturing variation is large.

The acceleration sensor is an MEMS capacitive acceleration sensor and has capacitive elements for signal detection and capacitive elements for servo control different from the capacitive elements for the signal detection. A voltage to generate force in a direction reverse to a detection signal of acceleration by the capacitive elements for the signal detection is applied to the capacitive elements for the servo control. Further, the acceleration sensor includes a variable capacity unit compensating for a mismatch of capacity values of the capacitive elements for the servo control at an ASIC side, detects a leak signal due to the mismatch of the capacity values in an ASIC, controls a capacity value of the variable capacity unit, on the basis of a detection result, compensates for an influence of the mismatch of the capacity values, and executes a normal signal detection/servo control simultaneous operation.

Provided is an acceleration sensor capable of realizing a simultaneous operation method of signal detection and servo control in place of a time-division processing method, by an MEMS process in which a manufacturing variation is large.

The acceleration sensor is an MEMS capacitive acceleration sensor and has capacitive elements for signal detection and capacitive elements for servo control different from the capacitive elements for the signal detection. A voltage to generate force in a direction reverse to a detection signal of acceleration by the capacitive elements for the signal detection is applied to the capacitive elements for the servo control. Further, the acceleration sensor includes a variable capacity unit compensating for a mismatch of capacity values of the capacitive elements for the servo control at an ASIC side, detects a leak signal due to the mismatch of the capacity values in an ASIC, controls a capacity value of the variable capacity unit, on the basis of a detection result, compensates for an influence of the mismatch of the capacity values, and executes a normal signal detection/servo control simultaneous operation.

An inertial measurement unit includes a sensor module including at least one inertial sensor and a printed substrate on which the inertia sensor is provided, and a lead group provided as a support member for supporting the printed substrate on an attachment surface, and leads of the lead group each have a first section coupled to the attachment surface, a second section extending from the first section toward the printed substrate in a direction that intersects the attachment surface, and a third section coupled to the printed substrate.

Described herein are methods and systems for configuring a motion sensor assembly to compensate for a temperature gradient. First and second sensors of the same type are arranged as opposing pairs with respect to a first axis that may be defined by a temperature gradient caused by at least one thermal element. Combining the output measurements of the first sensor and the second sensor allows effects of the temperature gradient on sensor measurements of the first sensor and the second sensor to be compensated.

Described herein are methods and systems for configuring a motion sensor assembly to compensate for a temperature gradient. First and second sensors of the same type are arranged as opposing pairs with respect to a first axis that may be defined by a temperature gradient caused by at least one thermal element. Combining the output measurements of the first sensor and the second sensor allows effects of the temperature gradient on sensor measurements of the first sensor and the second sensor to be compensated.

Disclosed herein are aspects of a multiple-mass, multi-axis microelectromechanical systems (MEMS) accelerometer sensor device with a fully differential sensing design that applies differential drive signals to movable proof masses and senses differential motion signals at sense fingers coupled to a substrate. In some embodiments, capacitance signals from different sense fingers are combined together at a sensing signal node disposed on the substrate supporting the proof masses. In some embodiments, a split shield may be provided, with a first shield underneath a proof mass coupled to the same drive signal applied to the proof mass and a second shield electrically isolated from the first shield provided underneath the sense fingers and biased with a constant voltage to provide shielding for the sense fingers.