Disclosed herein are aspects of a multiple-mass, multi-axis microelectromechanical systems (MEMS) accelerometer sensor device with a fully differential sensing design that applies differential drive signals to movable proof masses and senses differential motion signals at sense fingers coupled to a substrate. In some embodiments, capacitance signals from different sense fingers are combined together at a sensing signal node disposed on the substrate supporting the proof masses. In some embodiments, a split shield may be provided, with a first shield underneath a proof mass coupled to the same drive signal applied to the proof mass and a second shield electrically isolated from the first shield provided underneath the sense fingers and biased with a constant voltage to provide shielding for the sense fingers.

A force sensor including a support, a test body, two strain gauges, mechanical transmission means between the test body and the strain gauges so that a movement of the test body applies a strain onto the strain gauges in a first direction of the plane of the sensor, the transmission means being hinged relative to the support about a second direction in the plane of the sensor, the test body being accommodated within a first volume, the strain gauges being accommodated within a second volume, insulated by sealed insulation means. The sensor includes a sacrificial layer, a nanometric layer, a protective layer and a micrometric layer. The test body and at least one portion of the support are formed in the substrate, the sealed insulation means are partially formed by the nanometric layer and by the sacrificial layer, and the strain gauges are formed in the nanometric layer.

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

An inertia measurement module and three-axis accelerometer, comprising a first pole piece (4) located on a substrate and a mass block (1) suspendingly connected above the substrate via elastic beams (11, 12); the elastic beams (11, 12) includes a first elastic beam (12) and a second elastic beam (11), two ends of the second elastic beams (11) being connected to an anchor point (6) of the substrate, two ends of the first elastic beam (11) being connected to the mass block (1); a center of the first elastic beam (12) and/or the second elastic beam (11) deviates from a center of gravity of the mass block (1); the mass block (1) is further provided with a first movable electrode (9) and a second movable electrode (10) in a Y-axis and an X-axis direction; the movement of one axis in a plane of the inertia measurement module cannot be affected by an eccentric structure feature, such that both X-axis movement and Y-axis movement are linear movements, thus not intensifying an inter-axis coupling, and also not reducing displacement of a mass block on the X-axis and the Y-axis, thus improving capacitance detection precision.

An acceleration sensor includes: a semiconductor substrate that includes a support substrate and a semiconductor layer; a first-direction movable electrode; a second-direction movable electrode; a first-direction fixed electrode; a second-direction fixed electrode; and a support member. The acceleration sensor is configured to detect acceleration in a first direction in the surface direction of the semiconductor substrate and acceleration in a second direction orthogonal to the first direction and parallel to the surface direction. The first-direction movable electrode and the first-direction fixed electrode are provided such that an angle formed by an extended direction of the first-direction movable electrode and the first-direction fixed electrode and the second direction is sin.sup.−1(d/L)[deg], and the second-direction movable electrode and the second-direction fixed electrode are provided such that an angle formed by an extended direction of the second-direction movable electrode and the second-direction fixed electrode and the first direction is sin.sup.−1(d/L)[deg].

A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.

MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

In an acceleration sensor, a semiconductor layer is provided with a rod-shaped weight portion that passes through a center of a frame portion, extends in a second direction, and is connected to the frame portion through a first beam portion. A first-direction movable electrode and a second-direction movable electrode are provided on the weight portion. According to the above configuration, because a mass of the first- and second-direction movable electrodes can be applied to the vicinity of a center of the frame portion, and a rotational moment can be reduced. Thus, detection accuracy can be restrained from being reduced.

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

The present disclosure is directed to micro-electromechanical system (MEMS) accelerometers that are configured for a user interface mode and a true wireless stereo (TWS) mode of an audio device. The accelerometers are fabricated with specific electromechanical parameters, such as mass, stiffness, active capacitance, and bonding pressure. As a result of the specific electromechanical parameters, the accelerometers have a resonance frequency, quality factor, sensitivity, and Brownian noise density that are suitable for both the user interface mode and the TWS mode.