A measurement system for performing measurements. The measurement system includes a positioning system for positioning at least one device to be positioned. The positioning system includes at least two rotational positioner modules configured to perform a rotational movement, thereby rotating the device to be positioned, as well as at least one linear positioner module configured to perform a linear movement, thereby translationally moving the device to be positioned. The linear positioner module includes a mounting interface for the device to be positioned. The rotational positioner modules and the linear positioner module together are configured to move the device to be positioned from a starting point of the movement. The rotational positioner modules are configured to set the starting point. The linear positioner module is configured to move the mounting interface relative to the starting point.

A measurement system for performing measurements. The measurement system includes a positioning system for positioning at least one device to be positioned. The positioning system includes at least two rotational positioner modules configured to perform a rotational movement, thereby rotating the device to be positioned, as well as at least one linear positioner module configured to perform a linear movement, thereby translationally moving the device to be positioned. The linear positioner module includes a mounting interface for the device to be positioned. The rotational positioner modules and the linear positioner module together are configured to move the device to be positioned from a starting point of the movement. The rotational positioner modules are configured to set the starting point. The linear positioner module is configured to move the mounting interface relative to the starting point.

This application relates to a method of preparing a composite material for a semiconductor test socket, and a composite material prepared through the method. In one embodiment, the method includes preparing a powder mixture including (i) a metal powder comprising aluminum or aluminum alloy particles and magnesium particles and (ii) a polymer powder. The method may also include sintering the powder mixture to produce the composite material using a spark plasma sintering (SPS) process. This application also relates to a method of manufacturing a semiconductor test socket, the method including forming an insulating portion of the semiconductor test socket with the composite material. This application further relates to a semiconductor test socket produced through the method.

An assembly for interfacing an existing harness connector of an installed wiring harness to a test module. The assembly comprises: a harness-specific connector which is connectable to the existing harness connector, a test box connector module connected to the harness-specific connector, for connecting to a test module, and a unique identifier which is readable on the assembly and which is unique to the test box connector module; wherein the unique identifier is used to identify the test box connector module and to determine, from a list of unique mate-in interface IDs and associated connector configurations, which one of the associated connector configurations corresponds to the identifier of the assembly, and within the one of the associated connector configurations corresponding to the unique mate-in interface ID of the mate-in interface, to determine the correspondence between contacts of the test module to contacts of the existing harness connector.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

An apparatus including a frame forming an interface device configured for connection to a test chassis, and at least one interface connector coupled to the frame, the at least one interface connector corresponding to connectors of a unit under test, the interface device being configured for insertion through one or more sealable apertures of an environmentally protective chassis that houses the test chassis, and coupling to an interface device seating surface of the environmentally protective chassis without any intervening environmental interface or environmental interface plane located between the interface device seating surface and the test chassis, wherein the frame forming the interface device includes a first end plate configured with electrical connectors and mechanical attachment members configured to align and attach a circuit card to the interface device.

An apparatus including a frame forming an interface device configured for connection to a test chassis, and at least one interface connector coupled to the frame, the at least one interface connector corresponding to connectors of a unit under test, the interface device being configured for insertion through one or more sealable apertures of an environmentally protective chassis that houses the test chassis, and coupling to an interface device seating surface of the environmentally protective chassis without any intervening environmental interface or environmental interface plane located between the interface device seating surface and the test chassis, wherein the frame forming the interface device includes a first end plate configured with electrical connectors and mechanical attachment members configured to align and attach a circuit card to the interface device.

Self-healing polymers used to fabricate electrical devices or to coat electrical devices that have a metal or polymer substrate. The self-healing polymers can be made from modified polymers including polyurethanes, polyureas, polyamides and polyesters and, optionally, cross-linking agents and one or more catalysts. The self-healing polymers can be used to make cable ties, tape, conduit fittings and explosion-proof sealant materials.

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.