A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

Disclosed is an electrode lead gripper for a pressure activation device, and, in particular, an electrode lead gripper for a pressure activation device in which a current electrode terminal is configured to be stacked and mounted onto an electrode terminal base separately from a voltage electrode terminal and thus improved in contact reliability and increased in contact area in terms of contact with an electrode lead of a pouch type battery cell, thereby having advantages of decreasing contact resistance, reducing the amount of heat generated during charging/discharging, and resulting in further enhancing a charging/discharging efficiency.

A socket for electrically connecting a first electrical component, the upper surface of which is pressed upon by a pressing member, and a second electrical component which is positioned below the first electrical component, said socket being equipped with: a socket main body which has a placement surface on which the first electrical component is placed; and a holding part which is provided to the socket main body, holds the first electrical component to the socket main body by engaging the first electrical component in a pressed state in which the first electrical component is pressed upon by the pressing member, and releases the engagement with the first electrical component when the pressing member moves a prescribed distance away from the position which corresponds to the pressed state.

An experimental bench for an unmanned aerial vehicle (UAV) power system and avionics equipment, which relates to the technical field of UAV test, comprising a support component, a power system load-bearing component, an avionics equipment load-bearing component, a jacking component and a roller component. A plurality of power system load-bearing components are provided, and are fixedly arranged on the support components, respectively, and each power system load-bearing component is configured to carry the power system of a UAV; the avionics equipment load-bearing component is fixedly arranged on the support component, and the avionics equipment load-bearing component is configured to bear the avionics equipment of the UAV; the output end of the jacking component is fixedly connected to the bottom end of the support component.

An experimental bench for an unmanned aerial vehicle (UAV) power system and avionics equipment, which relates to the technical field of UAV test, comprising a support component, a power system load-bearing component, an avionics equipment load-bearing component, a jacking component and a roller component. A plurality of power system load-bearing components are provided, and are fixedly arranged on the support components, respectively, and each power system load-bearing component is configured to carry the power system of a UAV; the avionics equipment load-bearing component is fixedly arranged on the support component, and the avionics equipment load-bearing component is configured to bear the avionics equipment of the UAV; the output end of the jacking component is fixedly connected to the bottom end of the support component.

A snap-on assembly includes a housing that holds an integrated circuit with a sensor. A connector supplies power to the integrated circuit and transmits a signal from the integrated circuit to an electronic circuit. An insert fits into an opening of the housing and secures a conductor in the housing without a mechanical fastener. The sensor measures a magnetic field resulting from a current traveling through the conductor.

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.