An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

A test lead for an electrical meter is provided. The test lead comprises a flexible elongate member comprising a current sensing coil at least partially disposed about a flexible core along the length of the member. A first connector is disposed at one end of the member for coupling a respective end of the current sensing coil to a test port of an electrical meter. A second connector is disposed at an opposing end of the member for coupling a respective end of the current sensing coil to an electrically conductive member, to provide an electrical path, via the sensing coil, from the electrically conductive member to the first connector.

A test lead for an electrical meter is provided. The test lead comprises a flexible elongate member comprising a current sensing coil at least partially disposed about a flexible core along the length of the member. A first connector is disposed at one end of the member for coupling a respective end of the current sensing coil to a test port of an electrical meter. A second connector is disposed at an opposing end of the member for coupling a respective end of the current sensing coil to an electrically conductive member, to provide an electrical path, via the sensing coil, from the electrically conductive member to the first connector.

An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.

A method for determining a value indicative of the impedance of a suspension in the framework of impedance spectroscopy comprises the following steps: generating an excitation current through the suspension, oscillating at an excitation frequency; determining a first impedance measurement value on the basis of the excitation current and a first voltage at a first pair of measurement electrodes; determining a second impedance measurement value on the basis of the excitation current and a second voltage at a second pair of measurement electrodes; determining the value indicative of the impedance of the suspension by correlating the first impedance measurement and the second impedance measurement.

An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.

A probe card testing device includes a first sub-circuit board, a second sub-circuit board, a connecting structure layer, a fixing plate, a probe head and a plurality of conductive probes. The first sub-circuit board is electrically connected to the second sub-circuit board by the connecting structure layer. The fixing plate is disposed on the second sub-circuit board and includes an opening and an accommodating groove. The opening penetrates the fixing plate and exposes a plurality of pads on the second sub-circuit board. The accommodating groove is located on a side of the fixing plate relatively far away from the second sub-circuit board and communicates with the opening. The probe head is disposed in the accommodating groove of the fixing plate. The conductive probes are set on the probe head and in the opening of the fixing plate. One end of the conductive probes is in contact with the corresponding pads, respectively.

An electronic device according to various embodiments may include: a board; a communication circuit disposed on one face of the board and configured to process a communication signal in a designated frequency band; an antenna disposed on the one face of the board or inside the board; a connector disposed on another face of the board, and including a first contact electrically connected to a first signal path through which the communication circuit is configured to transmit a signal to the antenna in a first direction, and a second contact electrically connected to a second signal path through which the communication circuit configured to transmit a signal to the antenna in a second direction; and conductive pads disposed on the another face of the board spaced apart from the connector, and including at least two first pads corresponding to the first contact and at least two second pads corresponding to the second contact.

A sensor cable harness for coupling one or more sensors to at least one electrical asset of a power grid, comprises at least one sensor to sense a condition of the at least one electrical asset. At least one signal cable is configured to carry a sensor data signal from the at least one sensor to an electrical analytics unit (EAU). An asset indicator device is provided to at least temporarily couple to the at least one signal cable to indicate the at least one electrical asset being sensed by an assigned port of the EAU.