Some aspects of this disclosure are directed to an automated method to check electrostatic discharge (ESD) effect on a victim device. For example, some aspects of this disclosure relate to a method, including determining a probe point, in a circuit design, for determining effective resistance between the probe point and ground, where the probe point is on an ESD path of in the circuit design. The method includes determining voltage between the probe point and the ground. The method further includes comparing, by a processing device, a resistance value of the ESD path determined based a predefined electric current value at a source point and the measured voltage with a target resistance value range. The method further includes reporting a violation upon determining that the determined resistance value of the ESD path is outside the target resistance value range.

A measuring assembly for measuring a temperature and a voltage includes a contact element including a temperature sensor and an electrically conductive portion, a voltage measurement conductor electrically connected to the conductive portion of the contact element, and an electrically conductive fixation element electrically connected to the conductive portion of the contact element, the electrically conductive fixation element extending through a fixation hole of a busbar in a fixed state to connect to the busbar by an elastic force provided by the electrically conductive fixation element in the fixed state, and the electrically conductive fixation element pressing the contact element to a measuring surface of the busbar by the elastic force in the fixed state.

An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

Kelvin (4-wire) connecting cables are routinely used when performing dynamic measurements (i.e., measurements with time-varying signals) on electrochemical cells and batteries. Current-carrying and voltage-sensing conductor pairs within such cables comprise distributed-parameter two-wire transmission lines which may extend several meters in length. As with all such transmission lines, internally reflected waves can oscillate back and forth at high frequency (hf) whenever the lines are not terminated in their characteristic impedances. Such hf reflected waves, by interacting with measuring circuitry, can seriously degrade low-frequency measurement accuracy. Apparatus is disclosed herein that suppresses hf reflected waves oscillating on Kelvin connecting cables during dynamic measurements of cells and batteries.

A vehicle may include a vehicle charging system having an alternator operatively coupled to an engine and a controller. The controller may be programmed to output a warning indicative of a vehicle charging system fault in response to a quotient of a voltage drop associated with the alternator and an output current of the alternator exceeding a threshold value while the alternator is operating in a steady state condition.

An example test head manipulator includes a tower having a base and a track, where the track is vertical relative to the base, and arms to enable support for the test head. The arms are connected to the track to move the test head vertically relative to the tower, and the arms are configured to control rotation of the test head. Each of the arms includes a cam that is rotatable, and at least one plunger in contact with the cam and that is configured to contact the test head. Rotation of the cam is controllable to move the at least one plunger to offset an uncontrolled rotation the test head.

A contact terminal has a support section that holds an elastically deformable axle so as to rotate about the axle with an elastic deformation of the axle, and a contact section extending from the support section. The contact section has, at a distal end thereof, a contact portion configured to make a contact with a testing element. The contact section deforms elastically while rotating with the support section by the contact of the contact portion with the testing element.

A browser probe has a probe body including a signal line, a nose of electrical insulating material integral with and projecting from the probe body, a pin supported by the probe body and electrically conductively connected to the signal line, a spring exerting a biasing force on the pin, an electrically conductive probe tip supported by the nose at a distal end of the nose remote from the probe body, and a plurality of discrete resistors interposed between the pin and the probe tip within the nose. The resistors are supported independently of another so as to be slidable within the nose. The probe tip is electrically conductively connected to the signal line via the resistors and the pin under the biasing force exerted by the spring.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.