A device for current determination includes a shunt and a device for temperature measurement including a printed circuit board, an evaluation unit and a temperature sensor. The printed circuit board has a milled groove which runs spirally around the temperature sensor, so that the temperature sensor is arranged on a printed circuit board plateau defined by the milled groove and is displaceable in a direction that is parallel to a normal vector of a plane defined by the printed circuit board. When the temperature sensor is displaced relative to the plane of the printed circuit board, a restoring force is brought about between the printed circuit board and the temperature sensor, wherein the shunt includes a resistance region having a substantially flat surface, wherein the device for current determination is arranged in the resistance region on the surface of the shunt in such a way that the temperature sensor is arranged in thermal connection with the resistance region of the shunt, wherein voltage taps are arranged on both sides of the temperature sensor and electrically contact the surface of the shunt in order to detect a potential difference along the resistance region.

A current sensor includes a battery terminal portion that is conductive and is fastened to a battery post; a shunt resistor for current detection, which is formed in a plate shape and is electrically connected to the battery terminal portion; and a circuit board that is formed in a plate shape and is electrically connected to the shunt resistor, in which the shunt resistor is erected on a main surface of the circuit board. With this configuration, since the shunt resistor and the circuit board can be arranged so as not to face each other and not confront each other, the influence of heat generated by the shunt resistor can be suppressed.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.

A resistor arrangement for measuring current strength having connection elements and a resistor element between the connection elements. The connection elements and the resistor element are arranged in a plane and in a row such that the arrangement is strip-shaped and has its smallest spatial extent perpendicular to the current direction. The resistor element has two contact sides and the connection elements each have a contact face connected to the contact sides. When current flows through the arrangement, current flow lines are formed which are deflected at at least one of the contact sides by an angle of at least 5° at the transition from the connection element to the resistor element.

According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

A measurement system for determining an energy usage parameter of an electronic device under test is described. The measurement system includes a thermal chamber and an analysis circuit. The thermal chamber includes a housing, a temperature regulator and a thermal control circuit. The housing encloses an interior space of the thermal chamber, wherein the interior space is configured to accommodate the device under test. The thermal control circuit is configured to control the temperature regulator to keep a temperature of the interior space at a predefined reference temperature. The thermal control circuit is configured to determine a power consumption of the temperature regulator, wherein the power consumption is associated with keeping the temperature of the interior space at the predefined reference temperature. The analysis circuit is configured to determine at least one energy usage parameter of the device under test based on the determined power consumption. Further, a method of determining an energy usage parameter of an electronic device under test is described.