The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze the DUT based on the acquired image.

A circuit for detection and warning of electro-migration in a region on a printed circuit board between a first electrically conductive element having a first electrical characteristic and a second electrically conductive element having a second electrical characteristic different than the first. The circuit includes an electrically conductive guard track that is electrically isolated from the first and second elements in the region and has a normal condition electrical characteristic based on the first and second characteristics. The circuit includes an electrical characteristic supervisor to detect an electrical characteristic of the guard track. In response to electro-migration creating an electrical connection of the guard track to the first or second element, the guard track has an abnormal condition electrical characteristic different than the normal condition. In response to detecting the abnormal condition of the guard track, the supervisor effectuates a warning of electro-migration in the region.

It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors. For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

A method of measuring electromagnetic interference (EMI) to noninvasively identify component degradation or failure in power electronics circuitry. The method involves characterizing the degradation or failure characteristics of the component and modeling those characteristics to enable a machine learning algorithm to identify EMI frequency distribution characteristics that correspond to the degradation or failure. The EMI frequency distribution is measured and the data provided to the machine learning algorithm whereupon the algorithm identifies degradation or failures indicated by the measured data.

According to one embodiment, an information processing system includes a memory, an inputter, and a processor. The memory stores correlation information including a specification item group, an element item group, and a risk item group. The specification item group includes specification items. The element item group includes element items. The risk item group includes risk items. One of the specification items to be modified is selected by a first operation input to the inputter. One of the element items is selected by a second operation input to the inputter. When the first operation is input, the processor refers to the correlation information and extracts at least one of the element items having a correlation with the one of the specification items. The processor extracts at least one of the risk items having a correlation with one element item of the at least one of the element items selected.

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors.

For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

Dynamically monitoring of an electrically-isolated power bus for a DC power system is described, and includes dynamically monitoring voltage and current on the power bus to determine a variation in the voltage on the power bus. When the variation in the voltage on the power bus is less than a threshold, an active positive isolation resistance term and an active negative isolation resistance term are determined. A first voltage balance term is determined based upon a ratio of the active positive isolation resistance term and the active negative isolation resistance term. A dynamic positive isolation resistance term and a dynamic negative isolation resistance term are determined based upon the active negative isolation resistance term. A fault associated with the power bus is determined based upon the dynamic positive isolation resistance term and the dynamic negative isolation resistance term.

A method implemented by a software for a multimodal evaluation engine stored on a memory is provided herein. The software is executable by a processor coupled to the memory to cause the method. The method includes receiving multimodal signatures of an object of interest from inspection elements and processing the multimodal signatures to transform the multimodal signatures into formats. The method also includes generating data representations of the formats and detecting whether anomalies are present within the object of interest based on the data representations.