Provided is a measurement apparatus including a signal source configured to output a binary digital signal configuring a multi-tone waveform, a waveform acquisition unit configured to acquire an analog signal waveform generated in response to application of the digital signal to a device under test, and a computation unit configured to calculate a frequency characteristic of the device under test from the waveform acquired by the waveform acquisition unit, in which the signal source is configured to repeatedly output a signal upconverted by multiplying a pseudo-random binary sequence (PRBS) signal by a repeating rectangular wave with a reference frequency and a reference duty ratio.

A method for calibrating crosstalk errors in a system for measuring on-wafer S parameters and an electronic device are provided. The method includes two parts. The first part is the pre-calibration part, which obtain eight error terms of an on-wafer S parameter measurement system by using a thru calibration standard, two defined load calibration standards, two pairs of undefined reflect calibration standards, and the reciprocity properties of a passive reciprocal element. The first part performs pre-calibration on an uncalibrated system according to the eight error terms. The second part uses the pre-calibrated system to obtain the crosstalk errors of the measurement system, and performs a further calibration on the pre-calibrated system according to the crosstalk errors.

Examples of determining electronic component authenticity via electronic signal signature measurement are discussed. Reference pin identifiers corresponding to pins of a known authentic electronic component are determined. Measurement values corresponding to characteristics of pins of an electronic component are obtained, and pin identifiers based on the measurement values are generated. Accordingly, an indication that the electronic component is authentic can be provided based at least in part on a comparison of the pin identifiers and the reference pin identifiers.

The present disclosure discloses a Single-Event Transient (SET) pulse measuring circuit capable of eliminating impact thereof, and an integrated circuit chip. The SET pulse measuring circuit capable of eliminating impact thereof includes four parts: a SET pulse test chain, a latch circuit, a flip-flop test circuit, a latching self-trigger circuit. The integrated circuit chip is provided with a test chain module and two sets of SET pulse measuring circuits capable of eliminating impact thereof, and inputs of the two sets of SET pulse measuring circuits capable of eliminating impact thereof are the same and each are connected to an output terminal of the test chain module.

In a general aspect, a quantum error-correction technique includes applying a first set of two-qubit gates to qubits in a lattice cell, and applying a second, different set of two-qubit gates to the qubits in the lattice cell. The qubits in the lattice cell include data qubits and ancilla qubits, and the ancilla qubits reside between respective nearest-neighbor pairs of the data qubits. After the first and second sets of two-qubit gates have been applied, measurement outcomes of the ancilla qubits are obtained, and the parity of the measurement outcomes is determined.

A method of testing semiconductor devices includes contacting bond pads coupled to integrated circuitry on a first die of a plurality of interconnected die on a substrate using a probe system having probes and probe tests including parametric tests, continuity tests, and a kill die subroutine. Probe tests using the probe program are performed. Die are binned into a first bin (Bin 1 die) for being a good die for all probe tests, or a second bin (Bin 2 die) for failing at least one of continuity tests and parametric tests. The Bin 2 die are divided into a first sub-group that failed the continuity tests and a second sub-group that do not fail the continuity tests. A kill die subroutine is triggered including applying power sufficient to selectively cause damage to the second sub-group of Bin 2 die to generate a continuity failure and thus generate kill die.

A power monitor includes a detecting circuit, a processing circuit, and a warning circuit. The detecting circuit detects a first abnormal condition of a primary side circuit and a second abnormal condition of a secondary side circuit. The processing circuit calculates a first class and a first occurring number of the first abnormal condition, and calculates a second class and a second occurring number of the second abnormal condition. The processing circuit determines whether the first occurring number is larger than a first predetermined number corresponding to the first class; if it is, the processing circuit outputs a first abnormal signal. The processing circuit determines whether the second occurring number is larger than a second predetermined number corresponding to the second class; if it is, the processing circuit outputs a second abnormal signal. The warning circuit outputs a warning signal according to the first or the second abnormal signal.

A device includes a control circuit, a scope circuit, and a time-to-current converter. The control circuit is configured to receive a voltage signal from a voltage-controlled oscillator, delay the voltage signal for a delay time to generate a first control signal, and to generate a second control signal according to the first control signal and the voltage signal. The scope circuit is configured to generate a first current signal in response to the second control signal and the voltage signal. The time-to-current converter is configured generate a second current signal according to the first control signal, the voltage signal, a first switch signal, and a test control signal.

According to one aspect, an integrated circuit includes: an electronic module configured to generate a voltage at an output, and an electronic control circuit coupled to an output of the electronic module, the electronic control circuit comprising an emissive electronic component. The electronic control circuit is configured to cause the emissive electronic component to emit light radiation as a function of a value of the voltage at the output of the electronic module relative to a value of an operating voltage of the electronic module, and the operating voltage is specific thereto during normal operation of this electronic module. The light radiation emitted by the emissive electronic component is configured to diffuse to an outer face of the integrated circuit.

The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.