Disclosed herein are unitary printed circuit boards (PCBs) and methods of using them for testing an integrated circuit (IC). In some embodiments, a unitary PCB comprises a main board portion and a flexible PCB portion, which are configured to be detached from each other at a separation location on the unitary PCB. The main board portion comprises a plurality of pads, and the flexible PCB portion comprises a plurality of through-holes, where a layout of the through-holes corresponds to a layout of the plurality of pads. In some embodiments, a method of testing an IC of a device comprises separating the unitary PBC into a main board portion and a flexible PCB portion, attaching the IC to the main board portion, soldering the main board portion to a platform PCB of the device, and attaching the flexible PCB portion to the main board portion.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

A Kelvin probe according to one or more embodiments includes first and second probe pins in parallel to each other with a space in between. Each of the first and second probe pins includes: an elastic portion configured to expand and contract along a first line; a first contact on a second line parallel to the first line; and a second contact on the first line. The first and second contacts are directly electrically connected to each other, and supported such that at least one of the first and second contacts is reciprocally movable through an elastic force of the elastic portion. Both of the first contacts of the first and second probe pins are positioned between the first line of the first probe pin and the first line of the second probe pin when viewed on a plane comprising the first and second lines.

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

A test and measurement circuit including a capacitor in parallel with a device under test, a direct current voltage source configured to charge the capacitor, a pulse generator configured to generate a pulse for testing the device under test, and a sensor for determining a current in the device under test.

A probe is provided and is configured for placement against and for movement along a body of interest and is configured to control and minimize compressive forces induced by the probe on the body of interest. The probe includes a probe handle portion that includes an outer probe housing and a probe head portion that is movably disposed within the outer probe housing. The probe head portion has a first end that defines a contact surface for placement along the body of interest. The probe head portion further has an extension that protrudes outwardly therefrom a second end of the probe head portion that is opposite the first end. The probe has at least one constant force spring that is coupled to the outer probe housing and to the probe head portion and is configured to apply a force to the probe head portion in a distal direction for maintaining the probe in position against a surface of interest during examination thereof, while permitting axial movement of the probe head portion within the outer probe housing. The constant force spring comprises at least one rolled ribbon spring that is wound about at least one pulley that is coupled to the extension of the probe head portion and moves axially together with the probe head portion within and relative to the outer probe housing.

A high-frequency testing probe with a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend away from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon respective first and second sides of the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The positions of the first ends of the first and second probe tips are adjustable. The first and second probe tips may be coupled to the first and second conducting traces through respective first and second joints, and may be configured to rotate about the first and second joints.

It is herein described a contact probe of a testing head of an apparatus for testing electronic devices comprising a probe body being essentially extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body and comprising an enlarged portion, projecting only in correspondence of a first side wall of the contact probe. Suitably, the at least one end portion further comprises at least one protrusion projecting from a second side wall, opposite to the first side wall and substantially extending toward the second and opposite wall along a longitudinal axis of the contact probe starting from the enlarged portion.