A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A test and measurement instrument includes one or more ports including at least one test port configured to couple to one or more devices under test, a user interface to receive one or more user inputs, an acquisition memory to store waveform data acquired from the one or more devices under test, one or more processors configured to execute code that causes the one or more processors to: receive an input through the user interface; determine one or more requested data types based on the input; transform the waveform data into compressed data containing only data elements corresponding to the one or more requested data types; and transmit the compressed data to a client. A method of providing usage-aware compressed data from a test and measurement instrument includes acquiring waveform data from one or more devices under test, receiving a user input through a user interface, determining one or more requested data types based on the user input, transforming the waveform data into compressed data containing only data elements corresponding to the one or more requested data types, and transmitting the compressed data to a client.

A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

A testing device includes a testing socket and a reflector. The testing socket defines an accommodating space. The reflector is disposed in the accommodating space and has a plurality of reflection surfaces non-parallel with each other. The reflection surfaces define a transmission space.

A capacitive intelligent workstation detection system, comprising a capacitance detection sensor (1), a capacitive sensing module (201), a microprocessor module (202), a remote management platform (3) and a mobile APP, the capacitance detection sensor (1) detecting a capacitance change when a human body approaches, and after being processed by the capacitive sensing module (201), the capacitance change being sent to the microprocessor module (202) to form workstation state data, the workstation state data being sent to the remote management platform (3), and the remote management platform (3) processing the workstation state data, so as to obtain user habit data. A user uses the mobile APP to obtain relevant data by means of the remote management platform (3), and sends debugging and control information to a workstation detection device (2). The system uses the capacitive sensing module (201), has a small volume, a good concealment, a beautiful appearance and a flexible design, does not require complex optical and microwave devices and has no mechanical device, is less vulnerable to aging and abrasion, and has a long service life and good consistency. The remote management platform (3) serves as a data management and control center, and the mobile APP provides man-machine bidirectional interaction, so as to implement office electric appliance linkage energy-saving management and personnel management.

Methods, systems and techniques are provided to authenticate a device under test (DUT)/system under test (SUT) comprising an electronic component(s). A profile is defined by injecting a signal to elicit an output that is responsive a physical characteristic of the type of DUT/SUT. In respective embodiments the injected signal is defined to elicit an output for time-domain or frequency-domain evaluation. An injected signal may comprise combinations of (non-destructive/non-activating) signals applied to multiple access points for measurement at arbitrary access points of the DUT/SUT. In an embodiment, measurements of multiple DUT/SUTs of a same type are used to define a common profile. In an embodiment, the profile is built using machine learning to define a classifier. In other embodiments, statistical profiles are defined. During use, output is generated for a target DUT/SUT for evaluation relative to the profile. Counterfeit/alternate designs, altered designs, and implants are detectable.

The present disclosure describes exemplary methods and systems that are applicable for hardware authentication, counterfeit detection, and in-field tamper detection in both printed circuit board and/or integrated circuit levels by utilizing random variations in boundary-scan path delay and/or current in the industry-standard JTAG-based design-for-test structure to generate unique device identifiers.

System and method for compensating for power loss due to a radio frequency (RF) signal probe mismatch in conductive RF signal testing of a RF data signal transceiver device under test (DUT). Sourcing the RF test signal with the RF vector signal transceiver at multiple test frequencies enables isolation of and compensation for power loss due to a mismatch between the RF signal probe and RF DUT connection based on predetermined losses of the RF signal path.

A semiconductor device for testing a device under test includes a circuit board, a plurality of probes disposed below the circuit board and facing the device under test, an integrated substrate disposed between the circuit board and the plurality of probes, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The plurality of probes is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the plurality of probes through the integrated substrate and the circuit board to perform a test to the device under test. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.