A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A capacitance detection area sensor includes capacitance sensor elements arranged in a two-dimensional array, is shaped into an appropriate shape, and capacitively coupled to an external electrode. To the external electrode, a sensing signal having a potential difference is supplied. The first and second sensor output signals are acquired from a capacitance sensor element capacitively coupled to the external electrode, at the timing of the sensing signal being a first signal and being a second signal, respectively. A differential signal is generated from a difference between the acquired first and second sensor output signals, and an image indicating the shape of the external electrode is generated based on the level of the differential signal, in different colors or different tones.

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

There is provided an aircraft engine printed circuit board assembly generally having a functional circuit contributing to the operation of an aircraft engine. The functional circuit has a first substrate portion, a first electronic component supported by the first substrate portion, and a first electrical conductor supported by the first substrate portion and leading to the first electronic component. The aircraft engine printed circuit board assembly generally has a monitoring circuit having a second substrate portion, a second electronic component supported by the second substrate portion, a second electrical conductor supported by the second substrate portion and leading to the second electronic component, the second electrical conductor having a shorter life expectancy than the first electrical conductor, and a detector monitoring an indicator of operativeness of the second electrical conductor, in which the first electrical conductor and the second electrical conductor are both exposed to the same environment.

There is provided an aircraft engine printed circuit board assembly generally having a functional circuit contributing to the operation of an aircraft engine. The functional circuit has a first substrate portion, a first electronic component supported by the first substrate portion, and a first electrical conductor supported by the first substrate portion and leading to the first electronic component. The aircraft engine printed circuit board assembly generally has a monitoring circuit having a second substrate portion, a second electronic component supported by the second substrate portion, a second electrical conductor supported by the second substrate portion and leading to the second electronic component, the second electrical conductor having a shorter life expectancy than the first electrical conductor, and a detector monitoring an indicator of operativeness of the second electrical conductor, in which the first electrical conductor and the second electrical conductor are both exposed to the same environment.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A system for inspection of electrical circuits, which electrical circuits include a multiplicity of conductors which are mutually spaced from each other, the system including a voltage driver operative to apply different electrical voltages to a plurality of conductors from among the multiplicity of conductors, which plurality of conductors are in spatial propinquity to each other, a sensor operative to sense at least one characteristic of a test region defined thereby with respect to the electrical circuits, the sensor lacking sufficient spatial resolution to distinguish between the locations of individual ones of the plurality of conductors and a defect indicator responsive to at least one output of the sensor for ascertaining whether a defect exists in the plurality of conductors.

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.