An apparatus and a method for inspecting a semiconductor includes a water tank which includes a housing, an interior of which is filled with a liquid, and a support block which provides a settling surface for an inspection object inside the housing. A plurality of signal generators are installed on a bottom surface of the housing, and output a frequency signal in a direction in which the inspection object is located. A power supply operates the signal generators. A probe is placed above the inspection object, and a receiver which operates with the probe and is attached to a bottom surface of the support block. Foreign matter remaining on the inspection object are removed, using a plurality of frequency signals which are output by the plurality of signal generating units.

An inspection apparatus includes a light sensor that detects light from a semiconductor device to which an electric signal has been input, an optical system that guides light from the semiconductor device to the light sensor, and a control device electrically connected to the light sensor. The control device includes a measurement unit that acquires waveform data obtained by optical measurement for each of a plurality of positions on a defective semiconductor device and waveform data obtained by the optical measurement for each of a plurality of positions on a non-defective semiconductor device, a calculation unit that calculates a degree of correspondence between the waveform data of the defective semiconductor device and the waveform data of the non-defective semiconductor device, and an analysis unit that analyzes a defective part of the defective semiconductor device on the basis of the degree of correspondence for each of the plurality of positions.

An inspection apparatus includes a light sensor that detects light from a semiconductor device to which an electric signal has been input, an optical system that guides light from the semiconductor device to the light sensor, and a control device electrically connected to the light sensor. The control device includes a measurement unit that acquires waveform data obtained by optical measurement for each of a plurality of positions on a defective semiconductor device and waveform data obtained by the optical measurement for each of a plurality of positions on a non-defective semiconductor device, a calculation unit that calculates a degree of correspondence between the waveform data of the defective semiconductor device and the waveform data of the non-defective semiconductor device, and an analysis unit that analyzes a defective part of the defective semiconductor device on the basis of the degree of correspondence for each of the plurality of positions.

An optical probe includes a core part and a clad part arranged along an outer circumference of the core part, and has an incident surface having a radius of curvature R through which an optical signal enters. The radius of curvature R and a central half angle ω at an incident point of the optical signal on the incident surface fulfil the following formulae using a radiation angle γ of the optical signal, an effective incident radius Se of the optical signal transmitted in the core part without penetrating into the clad part on the incident surface, a refractive index n(r) of the core part at the incident point, and a refracting angle β at the incident point:

R=Se/sin(ω)

ω=±sin.sup.−1{[K2.sup.2/(K1.sup.2+K2.sup.2)].sup.1/2}

where K1=n(r)×cos(β)−cos(γ/2) and K2=n(r)×sin(β)−sin(γ/2).

An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

The present disclosure relates to a steady-state microwave conductivity method that includes modulating a light beam to form an amplitude modulated light having a modulation frequency ω.sub.1, producing a microwave waveform, exposing a sample to the amplitude modulated light and a first portion of the microwave waveform to produce an amplitude modulation signal on the first portion of the microwave waveform, and mixing a second portion of the microwave waveform and the amplitude modulation signal to produce a first signal and a second signal.

An image test system includes a test assembly and an image capture card. The test assembly is provided for obtaining a test signal from a test object, and includes an interface conversion circuit for converting signal transmission form of the test signal. The image capture card is provided for obtaining the test signal from the test assembly, and obtaining an image data from the test signal. The image test system further includes a test signal clock generation circuit for obtaining a test signal clock from the test signal, or the image capture card further includes a pair of clock input pins for obtaining the test signal clock directly from the test object.

An image test system includes a test assembly and an image capture card. The test assembly is provided for obtaining a test signal from a test object, and includes an interface conversion circuit for converting signal transmission form of the test signal. The image capture card is provided for obtaining the test signal from the test assembly, and obtaining an image data from the test signal. The image test system further includes a test signal clock generation circuit for obtaining a test signal clock from the test signal, or the image capture card further includes a pair of clock input pins for obtaining the test signal clock directly from the test object.