An inductive charging system can include a transmitter device and a receiver device. The transmitter device may be adapted to detect when a receiver coil in the receiver device is coupled to a transmitter coil in the transmitter device. For example, the current input into a DC-to-AC converter in the transmitter device can be measured and coil coupling detected when the current equals or exceeds a threshold value.

An inductive charging system can include a transmitter device and a receiver device. The transmitter device may be adapted to detect when a receiver coil in the receiver device is coupled to a transmitter coil in the transmitter device. For example, the current input into a DC-to-AC converter in the transmitter device can be measured and coil coupling detected when the current equals or exceeds a threshold value.

A method for checking a circuit devised for contactless data communication, which comprises an antenna and an electronic component coupled with the antenna, comprises the following steps: generating an alternating magnetic field of a field strength, and arranging the circuit in the alternating field region. Then the electronic circuit is excited by means of an energy pulse. In a further step, an oscillation of the circuit in response to the excitation of the circuit by the energy pulse is captured. The captured oscillation of the circuit is finally evaluated, in particular with regard to a self-resonant frequency of the circuit.

A method for checking a circuit devised for contactless data communication, which comprises an antenna and an electronic component coupled with the antenna, comprises the following steps: generating an alternating magnetic field of a field strength, and arranging the circuit in the alternating field region. Then the electronic circuit is excited by means of an energy pulse. In a further step, an oscillation of the circuit in response to the excitation of the circuit by the energy pulse is captured. The captured oscillation of the circuit is finally evaluated, in particular with regard to a self-resonant frequency of the circuit.

Provided is a short-circuit determining apparatus comprising: a sensor configured to detect a time change of a main current flowing between a first main terminal and a second main terminal of a switching device having a control terminal, the first main terminal and the second main terminal; an integration unit configured to integrate an output of the sensor; a polarity determining unit configured to determine a polarity of the output of the sensor; and a short-circuit determining unit configured to determine a short-circuit of the switching device, based on a comparison result of an output of the integration unit and a short-circuit determination reference value according to a determination result of the polarity.

Provided is a short-circuit determining apparatus comprising: a sensor configured to detect a time change of a main current flowing between a first main terminal and a second main terminal of a switching device having a control terminal, the first main terminal and the second main terminal; an integration unit configured to integrate an output of the sensor; a polarity determining unit configured to determine a polarity of the output of the sensor; and a short-circuit determining unit configured to determine a short-circuit of the switching device, based on a comparison result of an output of the integration unit and a short-circuit determination reference value according to a determination result of the polarity.

An assembly for detecting a structural defect in a semiconductor die is provided. The assembly includes a defect-detection sensor and a microcontroller. The defect-detection sensor includes a plurality of resistive paths of electrical-conductive material in the semiconductor die, each of which has a first end and a second end and extends proximate a perimeter of the semiconductor die. The defect-detection sensor includes a plurality of signal-generation structures, each coupled to a respective resistive path and configured to supply a test signal to the resistive path. The microcontroller is configured to control the signal-generation structures to generate the test signals, acquire the test signals in each resistive paths, test an electrical feature of the resistive paths by performing an analysis of the test signals acquired and detect the presence of the structural defect in the semiconductor die based on a result of the analysis of the test signals acquired.

An assembly for detecting a structural defect in a semiconductor die is provided. The assembly includes a defect-detection sensor and a microcontroller. The defect-detection sensor includes a plurality of resistive paths of electrical-conductive material in the semiconductor die, each of which has a first end and a second end and extends proximate a perimeter of the semiconductor die. The defect-detection sensor includes a plurality of signal-generation structures, each coupled to a respective resistive path and configured to supply a test signal to the resistive path. The microcontroller is configured to control the signal-generation structures to generate the test signals, acquire the test signals in each resistive paths, test an electrical feature of the resistive paths by performing an analysis of the test signals acquired and detect the presence of the structural defect in the semiconductor die based on a result of the analysis of the test signals acquired.

A device and a method for monitoring and analysis utilize unintended electromagnetic emissions of electrically powered components, devices or systems. The emissions are received at the antenna and a receiver. A processor processes and measures change or changes in a signature of the unintended electromagnetic emissions. The measurement are analyzed to both record a baseline score for future measurements and to be used in determining status and/or health of the analyzed system or component.

A testing apparatus comprises a first electromagnet. The first electromagnet can be configured to expose a first test device to a first electromagnetic field. The testing apparatus also comprises a second electromagnet. The second electromagnet can be configured to expose a second test device to a second electromagnetic field.