A control system, that includes a primary controller and various auxiliary controllers, is configured to facilitate a built-in self-test (BIST) of a system-on-chip (SoC). The primary controller is configured to initiate a BIST sequence associated with the SoC. Based on the BIST sequence initiation, each auxiliary controller is configured to schedule execution of various self-test operations on various functional circuits, various memories, and various logic circuits of the SoC by various functional BIST controllers, various memory BIST controllers, and various logic BIST controllers of the SoC, respectively. Based on the execution of the self-test operations, each auxiliary controller further generates various status bits with each status bit indicating whether at least one functional circuit, at least one memory, or at least one logic circuit is faulty. Based on the status bits generated by each auxiliary controller, a fault diagnosis of the SoC is initiated.

A memory temperature controlling method and a memory temperature controlling system are provided. The method includes: performing, by a testing equipment, test modes on a memory storage device, and obtaining a first internal temperature of a memory control circuit unit, a second internal temperature of each memory package and a surface temperature of each memory package to establish a linear relationship expression of the first internal temperature, the second internal temperature and the surface temperature; using, by the memory storage device, the linear relationship expression to calculate a predicted surface temperature of a rewritable non-volatile memory based on a first current internal temperature of the memory control circuit unit and a second current internal temperature of each memory package; adjusting, by the memory storage device, an operating frequency for accessing the rewritable non-volatile memory based on the predicted surface temperature.

A memory temperature controlling method and a memory temperature controlling system are provided. The method includes: performing, by a testing equipment, test modes on a memory storage device, and obtaining a first internal temperature of a memory control circuit unit, a second internal temperature of each memory package and a surface temperature of each memory package to establish a linear relationship expression of the first internal temperature, the second internal temperature and the surface temperature; using, by the memory storage device, the linear relationship expression to calculate a predicted surface temperature of a rewritable non-volatile memory based on a first current internal temperature of the memory control circuit unit and a second current internal temperature of each memory package; adjusting, by the memory storage device, an operating frequency for accessing the rewritable non-volatile memory based on the predicted surface temperature.

A clock control system for a scan chain generates two clock signals. During a shift phase of a testing mode of the scan chain, one clock signal is an inverted version of the other clock signal. The clock control system provides the clock signal and the inverted clock signal to two different scan flip-flops of the scan chain, respectively. Each of the two scan flip-flops performs a flip-flop operation when the received clock signal transitions from a de-asserted state to an asserted state. Thus, the two flip-flop operations are mutually exclusive during the shift phase. As a result, a dynamic voltage drop across the scan chain during the shift phase is reduced.

Disclosed is a test circuit for testing an integrated circuit core or an external circuit of the integrated circuit core. The test circuit may not only transmit a cell function input to a cell function output using only one multiplexer in a bypass mode, may but also use a clock gating scheme capable of blocking a clock signal from transmitting to a scan flip-flop to hold a capture procedure.

Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

A chip, a chip testing method and an electronic device are provided. The chip includes a combinational logic and a data path gating; the data path gating includes a first input terminal and an output terminal, the first input terminal of the data path gating detects a test enable signal, and the output terminal of the data path gating is connected to the combinational logic; the test enable signal is used to switch a test mode of the chip; the data path gating is configured to output a data path gating control signal to the combinational logic, in a case where the detected test enable signal indicates that a current test mode is irrelevant to a data path function of the combinational logic; and the combinational logic is configured to disable the data path function after receiving the data path gating control signal, to disable data path toggling.

The present disclosure provides a method of testing a single device under test (DUT) through multiple cores in parallel, which includes steps as follows. The test quantity of the DUT is calculated; the test quantity of the DUT is evenly allocated to to a plurality of test cores, so as to control a period of testing the DUT through the test cores in parallel.

This application provides a test circuit. The circuit includes: an input terminal, a processing circuit, and an output terminal. The input terminal receives an input signal. The input signal includes a test command for indicating a test target circuit module and an address of the target circuit module. The processing circuit responds to the test command and the target. The address of the circuit module determines the test mode signal, the test mode signal carries the test type, the test mode signal is used to trigger the target circuit module to perform the test corresponding to the test type, and the output terminal sends the test mode signal to the target circuit module according to the address of the target circuit module. Thus, the test mode signal can be accurately transmitted to different circuit modules in the memory chip.

A control system, that includes a primary controller and various auxiliary controllers, is configured to facilitate a built-in self-test (BIST) of a system-on-chip (SoC). The primary controller is configured to initiate a BIST sequence associated with the SoC. Based on the BIST sequence initiation, each auxiliary controller is configured to schedule execution of various self-test operations on various functional circuits, various memories, and various logic circuits of the SoC by various functional BIST controllers, various memory BIST controllers, and various logic BIST controllers of the SoC, respectively. Based on the execution of the self-test operations, each auxiliary controller further generates various status bits with each status bit indicating whether at least one functional circuit, at least one memory, or at least one logic circuit is faulty. Based on the status bits generated by each auxiliary controller, a fault diagnosis of the SoC is initiated.