An exemplary method of detecting a Trojan circuit in an integrated circuit is related to applying a test pattern comprising an initial test pattern followed by a corresponding succeeding test pattern to a golden design of the integrated circuit, wherein a change in the test pattern increases side-channel sensitivity; measuring a side-channel parameter in the golden design of the integrated circuit after application of the test pattern; applying the test pattern to a design of the integrated circuit under test; measuring the side-channel parameter in the design of the integrated circuit under test after application of the test pattern; and determining a Trojan circuit to be present in the integrated circuit under test when the measured side-channel parameters vary by a threshold.

A method of identifying defects in an electronic assembly, comprising, by a processing unit, obtaining a grid of nodes representative of a location of electronic units of an electronic assembly, wherein each node is neighboured by at most eight oiler nodes, wherein a first plurality of nodes represents failed electronic units according to at least one test criterion, and a second plurality of nodes represents passing electronic units according to the least one first test criterion, based on the grid, determining at least one first and second straight lines, and attempting to connect the first and second straight lines into a new line, wherein if at least one node from the new line belongs to the second plurality of nodes, concluding that an electronic unit represented by the node on the grid is a failed electronic unit, thereby facilitating identification of a failed electronic unit on the substrate.

A method for detecting abnormity of a machine slot includes the following operations. A first failure rate is obtained. A second failure rate is obtained. A slot, of which the second failure rate is greater than or equal to the abnormity value, is marked as a target slot, and A slot, of which the second failure rate is smaller than the abnormity value, is marked as a control slot. An significance level of a difference between a failure rate of the target slot and a failure rate of the control slot in each day of the second time period is checked.

A switching activity report of simulated switching activities of a semiconductor circuit is accessed. A plurality of glitch bottleneck ratios corresponding to a plurality of pins in the semiconductor circuit are determined, comprising by: setting an initial bottleneck ratio on a leaf output pin; and backward traversing the semiconductor circuit to determine a plurality of glitch bottleneck ratios of pins in a fan-in cone of the leaf output pin. A plurality of total glitch powers associated with the plurality of pins is determined, a total glitch power of the plurality of total glitch powers being determined based on a glitch bottleneck ratio and a glitch power of a corresponding pin. One or more critical bottleneck pins among the plurality of pins are identified based on the plurality of total glitch powers. One or more gates associated with the one or more critical bottleneck pins are adjusted to reduce corresponding one or more total glitch powers of the one or more gates.

The disclosure provides a method and apparatus of interleaved on-chip testing. The method merges a test setup for analog components with a test setup for digital components and then interleaves the execution of the digital components with the analog components. This provides concurrency via a unified mode of operation. The apparatus includes a system-on-chip test access port (SoC TAP) in communication with a memory test access port (MTAP). A built-in self-test (BIST) controller communicates with the MTAP, a physical layer, and a memory. A multiplexer is in communication with the memory and a phase locked loop (PLL) through an AND gate.

In certain aspects, a pattern generation system includes a pattern generator, a memory, a pin function register, a pin function mapper, and a set of source selectors. The pattern generator generates a plurality of source patterns. The memory stores a lookup table set. The lookup table set describes a mapping relationship between the plurality of source patterns and a set of test channels, and is indexed based on a pin function index. The pin function register stores a value of the pin function index. The pin function mapper executes a pin-mapping operation to generate a set of source selection signals based on the value of the pin function index and the lookup table set. Each source selector selects and outputs a source signal from the plurality of source patterns to a corresponding test channel based on a corresponding source selection signal received from the pin function mapper.

A method of identifying defects in an electronic assembly, comprising, by a processing unit, obtaining a grid of nodes representative of a location of electronic units of an electronic assembly, wherein each node is neighboured by at most eight other nodes, wherein a first plurality of nodes represents failed electronic units according to at least one test criterion, and a second plurality of nodes represents passing electronic units according to the least one first test criterion, based on the grid, determining at least one first and second straight lines, and attempting to connect the first and second straight lines into a new line, wherein if at least one node from the new line belongs to the second plurality of nodes, concluding that an electronic unit represented by the node on the grid is a failed electronic unit, thereby facilitating identification of a failed electronic unit on the substrate.

An integrated circuit method processes parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern, screens integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the integrated circuit die to an expected data pattern and, responsive to the comparing, determining whether a difference between the data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance.

A fault analysis method comprises: receiving fault data from wafer level testing that identifies locations and test results of a plurality of die; applying a kernel transform to the fault data to produce cluster data, where the kernel transform defines a fault impact distribution that defines fault contribution from the failed die to local die within an outer radial boundary of the fault impact distribution. Applying the kernel transform comprises: centering the fault impact distribution at a location of each die that failed wafer level testing, associating each local die that falls within the outer radial boundary with a respective fault contribution value according to the fault impact distribution, and accruing fault contribution values associated with each respective die of the plurality of die to produce a cluster value for the respective die, which correlates to a probability of failure of the respective die at a future time.

A system of monitoring performance of an electronic device including: a plurality of performance monitoring circuits included in an electronic device, wherein the plurality of performance monitoring circuits are configured to generate a plurality of monitor output signals including performance data of the electronic device; a monitoring bus configured to receive the plurality of monitor output signals and generate a. bus output signal by interleaving the performance data included in the plurality of monitor output signals; and an embedded trace router configured to receive the bus output signal and store, in a memory device included in the electronic device, the performance data. included in the bus output signal,