An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

A substrate for contacting an electrical pin arranged in a housing includes a base having a recess receiving the electrical pin, a metal leadframe having a contacting region electrically and/or thermally contacting the electrical pin, and a contact pin extending along a mating direction in a plane parallel to the metal leadframe and configured to electrically contact a mating contact pin of a mating connector. The metal leadframe is rigidly fixed to the base to prevent a relative movement between the metal leadframe and the substrate. The substrate is movable with respect to the housing along a locking direction from an unlocked position where the substrate is not locked to the housing to a locked position in which the substrate is locked to the housing. A movement of the contacting region with respect to the electrical pin is prevented in the locked position.

A substrate for contacting an electrical pin arranged in a housing includes a base having a recess receiving the electrical pin, a metal leadframe having a contacting region electrically and/or thermally contacting the electrical pin, and a contact pin extending along a mating direction in a plane parallel to the metal leadframe and configured to electrically contact a mating contact pin of a mating connector. The metal leadframe is rigidly fixed to the base to prevent a relative movement between the metal leadframe and the substrate. The substrate is movable with respect to the housing along a locking direction from an unlocked position where the substrate is not locked to the housing to a locked position in which the substrate is locked to the housing. A movement of the contacting region with respect to the electrical pin is prevented in the locked position.

An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.

A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degr.sub.est_t-1); estimating an estimated indicator of degradation (Degr.sub.est_t) by a temporal degradation model; obtaining a set of on-line measure (X.sub.on_meas_t); then, (1) converting the on-line measure (X.sub.on_meas_t) into a deducted indicator of degradation (Degr.sub.meas_t) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degr.sub.est_t; Degr.sub.meas_t); and/or (1) converting the estimated indicator of degradation (Degr.sub.est_t) into a set of on-line estimation (X.sub.on_est_t), and (2) computing a deviation between set of on-line measure and estimation (X.sub.on_meas_t; X.sub.on_est_t); and correcting the estimated indicator of degradation (Degr.sub.est_t) into a corrected estimated indicator of degradation (Degr.sub.corr_t) as a function of the computed deviation.

A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degr.sub.est_t-1); estimating an estimated indicator of degradation (Degr.sub.est_t) by a temporal degradation model; obtaining a set of on-line measure (X.sub.on_meas_t); then, (1) converting the on-line measure (X.sub.on_meas_t) into a deducted indicator of degradation (Degr.sub.meas_t) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degr.sub.est_t; Degr.sub.meas_t); and/or (1) converting the estimated indicator of degradation (Degr.sub.est_t) into a set of on-line estimation (X.sub.on_est_t), and (2) computing a deviation between set of on-line measure and estimation (X.sub.on_meas_t; X.sub.on_est_t); and correcting the estimated indicator of degradation (Degr.sub.est_t) into a corrected estimated indicator of degradation (Degr.sub.corr_t) as a function of the computed deviation.

The application discloses an auxiliary method and device for one time programmable (OTP) adjustment of a display panel. The auxiliary method includes: crimping and conducting a flexible circuit board to a display panel bonded with a chip by means of pre-bonding, to lead a crimping impedance by the flexible circuit board; detecting the crimping impedance led by the flexible circuit board; and screening a detected crimping impedance value to determine whether the OTP adjustment is enabled, wherein when the crimping impedance value meets a preset condition, the OTP adjustment is enabled, and when the crimping impedance value does not meet the preset condition, the OTP adjustment is disabled.

The application discloses an auxiliary method and device for one time programmable (OTP) adjustment of a display panel. The auxiliary method includes: crimping and conducting a flexible circuit board to a display panel bonded with a chip by means of pre-bonding, to lead a crimping impedance by the flexible circuit board; detecting the crimping impedance led by the flexible circuit board; and screening a detected crimping impedance value to determine whether the OTP adjustment is enabled, wherein when the crimping impedance value meets a preset condition, the OTP adjustment is enabled, and when the crimping impedance value does not meet the preset condition, the OTP adjustment is disabled.

Disclosed is an electronic device is provided. The electronic device includes a first substrate, a second substrate arranged to be spaced apart from the first substrate, a first cable electrically connecting a first point on the first substrate and a second point on the second substrate, and a second cable electrically connecting a third point on the first substrate and a fourth point on the second substrate. The first substrate may include a first communication circuit, a second communication circuit, a detection circuit, a voltage application unit, and a ground unit, and a second substrate may include a first antenna, a first capacitive element, a second antenna, a second capacitive element, and an isolation circuit. The isolation circuit may isolate a radio frequency (RF) signal between the first path and the second path, and electrically connect the detection circuit to the ground unit through the first cable and the second cable.