An arrayed waveguide grating device includes an input coupler configured to receive a light signal and split the light signal into a plurality of output light signals. The device also includes a plurality of waveguides optically connected to the input coupler, each waveguide having a plurality of waveguide portions having respective sensitivities to variance in one or more parameters associated with operating of the optical arrayed grating device. Lengths of the respective portions are determined such that each waveguide applies a respective phase shift to the output light signal that propagates through the waveguide and the plurality of waveguides have at least substantially same change in phase shift with respective changes in the one or more parameters associated with operation of the device. An output coupler is optically connected to the plurality of waveguides to map respective light signals output from the plurality of waveguides to respective focal positions.

A waveguide grating antenna apparatus includes a substrate layer, an asymmetric waveguide array layer upon the substrate layer, and a waveguide grating array layer formed above the asymmetric waveguide array layer. The waveguide array layer is composed of two forms of waveguide structures arranged in parallel. Each waveguide of the first form extends continuously, has a first width, and is laterally separated from each adjacent waveguide of the first form by a gap distance. Each waveguide of the second form extends parallel to and between adjacent waveguides of the first form within the first gap distance and is narrower than each of the first width and the gap distance. Pairs of the second form are closer to lateral sides of a first alternating set of the first form. The waveguide grating is composed of adjacent, separated elements extending axially along each waveguide of the first form.

An optoelectronic chip includes optical inputs having different passbands, a photonic circuit to be tested, and an optical coupling device configured to couple said inputs to the photonic circuit to be tested.

A light conversion portion is constituted by a conversion material that converts infrared light to visible light. A reflection portion is fixed to a position on a main substrate at which the reflection portion faces an output end of an optical waveguide chip on the side from which light is output to an external space. The reflection portion includes a reflection surface that faces the output end and is inclined with respect to a plane of the main substrate such that a reflection direction is toward the upper side of the main substrate. The reflection surface reflects near infrared light.

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

A sensor for use in biosensing is disclosed. The sensor comprises a photonic crystal waveguide comprising a photonic crystal comprising holes in a layer of dielectric material and a waveguide in the photonic crystal. The sensor comprises at least one strip disposed on the photonic crystal waveguide, spaced apart along, and running across the photonic crystal waveguide so as to form respective strip cavities, each of the at least one strip including a respective layer of material for sensing presence of a respective analyte; and a slot running along the waveguide of the photonic crystal waveguide.

A photonic module, comprising a first waveguide; a second waveguide, disposed on an opposing side of the first waveguide to a substrate; and, a coupling section. One of the first waveguide and the second waveguide is formed of crystalline silicon. The other of the first waveguide and the second waveguide is formed of amorphous silicon. The coupling section is configured to couple light between the first waveguide and the second waveguide. Such a silicon photonic module has enhanced coupling and transmission properties in contrast to conventional modules.

An optical transceiver may include an optical receptacle configured to input or output an optical signal, a first planar lightwave circuit through which the optical signal travels, an arrayed waveguide grating connected to the first planar lightwave circuit, and a first spot size converter connecting the optical receptacle and the first planar lightwave circuit.

Arrayed waveguide gratings (AWGs) are important components in coarse wavelength divisional multiplexing (CWDM) and dense wavelength division multiplexing (DWDM). However, the waveguides forming the array must be separated by a distance large enough to suppress parasitic coupling between the adjacent waveguides and thus limiting reductions in device footprint and insertion loss between the input/output coupler regions and the central region comprising the arrayed waveguides. The inventors have established a design methodology allowing the waveguide separation to be reduced whilst limiting cross-coupling thereby allowing for reduced footprints and insertion loss.

A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.