A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member, a central bar member, and a screw. The bow-shaped frame member is characterized by a higher or great coefficient of thermal expansion (CTE) than that of the central bar member such that the bow-shaped frame member can expand and elongate at a greater rate than can the central bar member under hot temperature conditions, however, under cold temperature conditions, the rate of contraction of the bow-shaped member is effectively retarded by the slower rate of contraction of the central bar member. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the athermal arrayed waveguide grating (AAWG) module in order to maintain the proper focus of the athermal arrayed waveguide grating (AAWG) module across disparate temperature conditions within which the athermal arrayed waveguide grating (AAWG) module is designed to operate.

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

A semiconductor photonic package can include a laser module and a photonic integrated circuit (PIC), each having a different operating temperature. The two modules are placed on a common substrate allowing accurate optical alignment. In addition, a thermal barrier is integrated into the substrate between the laser module and the PIC to provide thermal stability, especially to the laser module. The substrate can include a housing with good electrical conductivity or an optical substrate and housing. The thermal barrier is integrated into the optical substrate, the housing, or both. The thermal barrier in the optical substrate can be a cutout that does not divide the optical substrate into two separate pieces.

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member, a central bar member, and a screw. The bow-shaped frame member is characterized by a higher or great coefficient of thermal expansion (CTE) than that of the central bar member such that the bow-shaped frame member can expand and elongate at a greater rate than can the central bar member under hot temperature conditions, however, under cold temperature conditions, the rate of contraction of the bow-shaped member is effectively retarded by the slower rate of contraction of the central bar member. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the athermal arrayed waveguide grating (AAWG) module in order to maintain the proper focus of the athermal arrayed waveguide grating (AAWG) module across disparate temperature conditions within which the athermal arrayed waveguide grating (AAWG) module is designed to operate.

An optical circuit including an optical waveguide including temperature compensation structure filled with a temperature compensation material, the optical circuit including adiabatic transition structure in which an optical wave propagating through the optical waveguide adiabatically transitions to the temperature compensation structure filled with the temperature compensation material.

A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member and a central bar member. The bow-shaped frame member is characterized by a higher coefficient of thermal expansion than that of the central bar member such that the bow-shaped frame member can expand and contract at variable rates compared to that of the central bar member under certain temperature conditions. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the AAWG module in order to maintain the proper focus of the AAWG module across disparate temperature conditions.

An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.

An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

An athermal optical waveguide structure such as an optical add drop multiplexer (OADM) or the like is fabricated by a method that includes forming a lower cladding layer on a substrate. A waveguiding core layer is formed on the lower cladding layer. An upper cladding layer is formed on the waveguiding core layer and the lower cladding layer a sol-gel material. The sol-gel material includes an organically modified siloxane and a metal oxide. A thermo-optic coefficient of the sol-gel material is adjusted by curing the sol-gel material for a selected duration of time at a selected temperature such that the thermo-optic coefficient of the sol-gel material compensates for a thermo-optic coefficient of at least the waveguiding core layer such that an effective thermo-optic coefficient of the optical waveguide structure at a specified optical wavelength and over a specified temperature range is reduced.