An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.

An optical connector assembly includes first and second optical ferrules. Each of the first and second optical ferrules includes a front portion extending forwardly from a rear portion. The rear portion includes a top side and a bottom side. The bottom side of the rear portion defines a recessed portion. The first and second optical ferrules mate with each other such that the front portion of each of the first and second ferrules is disposed in the recessed portion of the other one of the first and second ferrules. Discrete retainers are assembled to opposite ends of the mated first and second ferrules. Each of the retainers defines a resilient portion resiliently forcing the front portion of one of the first and second mated ferrules against the other one of the first and second optical ferrules.

Structures including an optical component and methods of forming a structure including an optical component. The structure includes an optical component on a substrate, and a back-end-of-line stack including multiple metal levels. Each of the metal levels includes a dielectric layer and metal features positioned over the optical component as metal fill in the dielectric layer. The metal features in at least two of the metal levels are arranged to overlap such that the optical component is fully covered normal to the substrate.

A mounted hollow-core fiber arrangement includes a hollow-core fiber having a microstructure, and a mount arrangement including a plurality of mounting contacts configured to apply a force to an outer layer of the hollow-core fiber. A portion of the hollow-core fiber is located in a receiving region of the mount arrangement. The plurality of mounting contacts are positioned around the receiving region. The mounting contacts are distributed around the receiving region, the distribution of the mounting contacts corresponding to a distribution of features of the microstructure of the hollow-core fiber. The mounted hollow core fiber can be used in a radiation source apparatus for providing broadband radiation.

A method for manufacturing a fan-in-fan-out device which does not require processing of a small-diameter hole and improves work efficiency of installation of an optical fiber, includes: arranging a first holding member in a hole of a second holding member, the hole being larger than an outer diameter of the first holding member, and holding a plurality of optical fibers between the first holding member and the second holding member respectively along a plurality of grooves formed on an outer periphery of the first holding member or an inner periphery of the hole of the second holding member; heating and integrally melting the arranged first holding member, the plurality of held optical fibers, and the second holding member in a portion including an axial end portion of the second holding member; and drawing the melted portion.

A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

An object to provide a submarine optical transmission apparatus capable of efficiently housing optical components and electric components. First component housing units can house either or both of an optical component and an electric component and are stacked in a Z-direction. A case can house the first component housing units and a longitudinal direction thereof is an X-direction. A heat dissipating member is disposed in the case and conducts heat generated in the first component housing units to the case.

An optical waveguide based side illuminating assembly having an elongated, side-emitting light waveguide, an optical protective coating surrounding the waveguide, an elongated base to which the waveguide is attached lengthwise along the elongated base, via the optical protective coating, a reflector between the optical protective coating and the elongated base and extending lengthwise along the base, and an elongated reinforcing structure embedded in the elongated base, or attached to an outer surface of the elongated base, and extending lengthwise along the elongated base. Other aspects are also described and claimed.

An optical fiber array includes a V-groove substrate in which a V-groove for optical fiber alignment is formed, a pressing plate laminated and bonded on the V-groove substrate, and an optical fiber bonded and fixed in the V-groove of the V-groove substrate, wherein a distance between the optical fiber and the V-groove is less than 20 μm.

Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A first waveguide core has a first section that has a tapered shape and a second section that is adjoined to the first section. Multiple segments are positioned with a spaced arrangement adjacent to an end surface of the second section of the first waveguide core. A slab layer is adjoined to the first section of the first waveguide core. A second waveguide core has a section that overlaps with the first section of the first waveguide core to define a layer stack. The section of the second waveguide core has a tapered shape, and the first and second waveguide cores are comprised of different materials. The first section of the first waveguide core has a first thickness, and the slab layer has a second thickness that is less than the first thickness.