An apparatus for detecting an emission signal from each of a plurality of emission signal sources includes one or more excitation sources configured to generate an excitation light of an excitation wavelength and one or more associated emission detectors configured to detect light of an emission wavelength. A transmission fiber is associated with each of the emission signal sources. A carrier is configured to move the one or more excitation sources and the one or more emission detectors relative to the transmission fibers to sequentially place each emission detector and associated excitation source in an operative position with respect to each transmission fiber. Each transmission fiber transmits both the excitation light from the excitation source and the corresponding emission light to the associated emission detector.

A method of manufacturing an optical cable includes providing a plurality of fibers supported by a support structure, wherein, positions of the plurality of fibers in a reference cross-section form N rows extending in a first direction and M rows extending in a second direction different from the first direction. The method includes separating fiber ends at the first cable end into N rows and connectorizing them with N connectors. The method also includes separating fiber ends at the second cable end into M rows and connectorizing them with M connectors.

The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.

A connector system includes: a first ferrule configured to hold end parts of multi-core fibers; a second ferrule configured to hold end parts of single-core fibers; and an optical connection member. The optical connection member is arranged between the first and the second ferrule, and includes an optical system configured to optically connect respective cores included in the multi-core fibers and the single-core fibers. A guide pin is formed on one of the first and the second ferrule, and a guide hole is formed in another of the first and the second ferrule. A through hole is formed in the optical connection member, and the first ferrule, the optical connection member, and the second ferrule can be aligned by fitting the guide pin in the guide hole through the through hole.

An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.

A two-dimensional (2D) optical fiber array component takes the form of a (relatively inexpensive) fiber guide block that is mated with a precision output element. The guide block and output element are both formed to include a 2D array of through-holes that exhibit a predetermined pitch. The holes formed in the guide block are relatively larger than those in precision output element. A loading tool is used to hold a 1×N array of fibers in a fixed position that exhibits the desired pitch. The loaded tool (holding the pre-aligned 1×N array of fibers) is then inserted through the aligned combination of the guide block and output element, and the fiber array is bonded to the guide block. The tool is then removed, re-loaded, and the process continued until all of the 1×N fiber arrays are in place. By virtue of using a precision tool to load the fibers, the guide block does not have to be formed to exhibit precise through-hole dimensions, allowing for a relatively inexpensive guide block to be used.

Embodiments disclosed herein include optical connectors for photonic packages. In an embodiment an optical connector comprises a socket and a ferrule inserted into the socket. In an embodiment, the optical connector further comprises a first row of optical fibers in the ferrule, and a second row of optical fibers in the ferrule over the first row. In an embodiment, the optical connector further comprises a fiber distribution housing where the first row of optical fibers and the second row of optical fibers are spread laterally within the fiber distribution housing.

The present disclosure relates to an optical sensor assembly. According to one aspect of the present disclosure, an embodiment of the optical sensor assembly is provided. The optical sensor assembly includes a plurality of optical fibers, wherein one ends of the plurality of optical fibers are configured in a row, and the other ends of the plurality of optical fibers are stacked in at least two rows, such that a width of a first surface formed by the one ends of the plurality of optical fibers is greater than a width of a second surface formed by the other ends of the plurality of optical fibers, and the optical sensor assembly further includes a sensor connector optically coupled with the second surface. And the sensor connector can be separated from the first surface and configured inside the electronic device.

A first time/temperature data set includes temperatures and time stamps recorded at time intervals during a first thermal cycling process and a time stamp for each time interval, and a second time/temperature data set includes temperatures and time stamps recorded at time intervals during a second thermal cycling process. Signal emissions at different signal detecting positions are sequentially measured at different time intervals to generate first and second time/signal emission data sets for receptacles subject to the first and second thermal cycling processes, respectively. Signal emissions of receptacles subject to the first thermal cycling process are synchronized with specific temperatures of the first thermal cycling process by comparing time stamps of the first time/signal emission data set for each receptacle with the time stamps of the first time/temperature data set that correspond with the specific temperature. Signal emissions of receptacles subject to the second thermal cycling process are synchronized with specific temperatures of the second thermal cycling process by comparing time stamps of the second time/signal emission data set for each receptacle with the time stamps of the second time/temperature data set that correspond with the specific temperature.

The present disclosure relates to an optical sensor assembly. According to one aspect of the present disclosure, an embodiment of the optical sensor assembly is provided. The optical sensor assembly includes a plurality of optical fibers, wherein one ends of the plurality of optical fibers are configured in a row, and the other ends of the plurality of optical fibers are stacked in at least two rows, such that a width of a first surface formed by the one ends of the plurality of optical fibers is greater than a width of a second surface formed by the other ends of the plurality of optical fibers, and the optical sensor assembly further includes a sensor connector optically coupled with the second surface. And the sensor connector can be separated from the first surface and configured inside the electronic device.