Apparatuses, systems, and associated methods of manufacturing are described that provide an optical interposer and associated communication system. An example optical interposer includes a substrate having a first end that receives a first optical fiber welded thereto and a second end that receives a plurality of photonic integrated circuits (PICs) attached thereto. The interposer further includes an optical waveguide network defined by the substrate that provides optical communication between the first welded optical fiber and the plurality of PICs. The optical waveguide network also includes optical redistribution elements supported by the substrate. In an operational configuration, the optical interposer receives a first input optical signal from the first welded optical fiber, and the plurality of optical redistribution elements successively split the first input optical signal such that a plurality of output optical signals is directed to the plurality of PICs.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

A Michelson interference optical fiber temperature sensor for detecting fringe contrast change is provided. It includes a light source, an optical fiber coupler connected to a first optical fiber and a second optical fiber, a coarse wavelength division multiplexer, a first photodetector, a second photodetector, a display device, and a processing circuit connected to the display device. The light source, optical fiber coupler and coarse wavelength division multiplexer are connected sequentially in that order. The coarse wavelength division multiplexer is connected to the first photodetector and the second photodetector individually. The first photodetector and the second photodetector are connected to the processing circuit. An end of the first optical fiber or the second optical fiber facing away from the optical fiber coupler is connected to a semiconductor. It has advantages of simple and fast manufacturing process, safe and reliable sensor, stable signal, low cost, high sensitivity and high precision.

An optical device includes a waveguide device and a fiber stub. The fiber stub at least partially contains a first optical fiber and is directly attached to the waveguide device by an adhesive. The first optical fiber is to be coupled to a second optical fiber included in an optical connector when the optical connector is inserted into a receptacle of the optical device. The fiber stub is to couple the first optical fiber to at least one of the waveguide device or an optical waveguide included in the waveguide device.

Methods, devices, and systems for welding optical fibers and perforated elements by pulsed laser beam are provided. In one aspect, a method includes focusing a pulsed laser beam onto a region of a joining surface formed by an outer circumference of an optical fiber and an inner circumference of a hole of a perforated element, a beam direction of the pulsed laser beam running in an axial direction of the joining surface, and moving a laser focus of the pulsed laser beam in the region axially in or counter to the beam direction to produce at least one weld seam in the region. The optical fiber and the perforated element are locally melted in the region by the pulsed laser beam focused into a material of the optical fiber and a material of the perforated element and are thereby welded to one another.

An optical module in which an optical element is housed in a housing includes: an optical window member through which input light to the optical element or output light from the optical element passes and which hermetically seals inside of the housing; and a holding member that holds the optical window member. The optical window member is fixed to the housing by the holding member. A difference between linear expansion coefficients of the holding member and the optical window member is smaller than a difference between linear expansion coefficients of the housing and the optical window member. A position where the optical window member is attached on the holding member protrudes to an optical element side from a position where the holding member itself is fixed.

An optical communication module outputting light directly into an optical fiber and not requiring lenses or other light-guiding elements includes a printed circuit board, an optical-signal transmitter mounted on the printed circuit board and including a light emitting element. An optical fiber is directly connected to the light emitting element, and an optical-fiber connector is connected to the optical fiber. The light emitting element emits light beams into the optical fiber. A method of manufacturing such module is also disclosed.

The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.

The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.

A transistor outline (TO) package including a header with at least one optoelectronic device and a pot-shaped metal cap bonded to the header such that a hermetically sealed interior is formed for arranging the at least one optoelectronic device therein. The metal cap includes a window, which is transmissive to electromagnetic radiation, a lateral wall, and an end wall. A portion of the lateral wall and a portion of the end wall are formed with an increased thickness towards the interior compared to a portion of the lateral wall adjacent to the header. The thickened lateral wall portion and the thickened end wall portion have an identical wall thickness.