Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.

A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.

An optical module includes a housing, a circuit board, a package, and at least one of a light-emitting assembly or a light receiving assembly. The package includes a package body and a soldering member. The package body includes a cavity. An end of the circuit board is inserted into the cavity, and the soldering member is located in a gap between the circuit board and the package body. The light-emitting assembly or the light receiving assembly is located in the cavity and electrically connected to the circuit board. The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module, and the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board.

A semiconductor device includes a plurality of intermediate waveguides. The plurality of intermediate waveguides are vertically disposed on top of one another, and vertically adjacent ones of the plurality of intermediate waveguides are laterally offset from each other. When viewed from the top, each of the plurality of intermediate waveguides essentially consists of a first portion and a second portion, the first portion has a first varying width that increases from a first end of the corresponding intermediate waveguide to a middle of the corresponding intermediate waveguide, and the second portion has a second varying width that decreases from the middle of the corresponding intermediate waveguide to a second end of the corresponding intermediate waveguide.

A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.

Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.

Devices and methods are disclosed for an optical component mounting system for supporting an optical component such as a laser. The mounting system comprises a first component comprising a first surface, a second component comprising a second surface facing the first surface, and adhesive between the first surface of the first component and the second surface of the second component, wherein the first component comprises at least three mounting pads extending from the first surface for contacting the second surface of the second component and providing direct support between the first component and the second component. The component comprising the mounting pads may be a lower mount, an upper mount such as an upper clamping mount, or a bonding pad or other component in the stack of components. A method of assembling the stack of components may comprise curing the adhesive at a temperature at or above an upper end of an expected temperature operating range for the optical component mounting system.

A semiconductor package includes a base substrate structure having a top surface that includes conductive regions disposed in a dielectric region. The conductive regions are coupled to an interconnect structure. The semiconductor package also includes a first die bonded sideways on the base substrate structure. A side surface at an edge of the first die is bonded to the top surface of the base substrate structure. A front surface of the first die is perpendicular to the top surface of the base substrate structure. The first die includes a photonic device on a substrate of the first die, and the substrate includes an optical interface for coupling a back surface of the first die to an optical fiber.

A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.