Patent classifications
G02B6/4242
Photonic semiconductor device and method of manufacture
A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.
Fixture and method for attaching fibers to V-grooves of photonic integrated circuit
A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
Fixture And Method For Attaching Fibers To V-Grooves Of Photonic Integrated Circuit
A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
OPTICAL WAVEGUIDE PACKAGE AND LIGHT-EMITTING DEVICE
An optical waveguide package includes a substrate, and an optical waveguide layer on an upper surface of the substrate. The optical waveguide layer includes a cladding and a core in the cladding. The cladding has at least one first recess having a bottom surface and a first inner wall surface surrounding the bottom surface. The first inner wall surface of the at least one first recess is inclined and has an upper side outward from a lower side.
Micro-optical connector holder with integrated mating system
A micro-optical connector holder with an integrated mating system for an optical assembly, typically on a modem PCBA. The integrated mating system is used to hold the micro-optical connectors together during assembly and to apply constant pressure keeping the connectors fully mated. The invention also uses a spring-pin mechanism to keep the holder lid and connectors in place without the use of screws or glue to make assembly easier. The integrated mating system allows the micro-optical connectors to be easily installed and uninstalled for manufacturing and testing purposes. The connector plugs and connector receptacles are aligned and secured by the integrated connector holder.
Photonic Semiconductor Device and Method of Manufacture
A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.
Line illuminating device
A line illuminating device includes: a light emitting unit that emits light; a light guide rod that is formed into a rod shape, transmits therethrough the light emitted by the light emitting unit, and guides the light in a longitudinal direction; a case that is formed into a rod shape, has a part open when viewed from the longitudinal direction, and houses the light guide rod therein; ribs provided so as to protrude from the light guide rod on both ends of the light guide rod in the longitudinal direction; and rib guide portions which are provided on both ends of the case in the longitudinal direction, guide the ribs when the light guide rod is housed in the case, and restricts rotation of the light guide rod with respect to the case.
Connecting structure of optical module and optical connector
To make connection work be done easily and certainly, and, further, space-saving be achieved, when an optical fiber and an optical module are connected. An optical module includes a connecting face connected with an optical connector and a first diffraction grating, provided in an end part of a first optical waveguide, to convert an optical axis direction of the first optical waveguide to a direction toward an opposing face of the optical connector; in the optical connector, the second optical waveguide is provided in the optical connector along the opposing face toward the connecting face; the optical connector includes a second diffraction grating, provided in an end part of the second optical waveguide, to convert an optical axis direction of the second optical waveguide into a direction toward the optical module; and while the optical module and the optical connector are connected mechanically to make the opposing face of the optical connector oppose the connecting face of the optical module, the first diffraction grating and the second diffraction grating opposing each other and being coupled optically.
OPTICAL CONNECTION MODULE
An optical connection module includes a substrate, a light source, an optical detector, at least one first optical channel, at least one second optical channel, an oblique surface and a light guide device. The light source is disposed on the substrate and is configured to emit a first light. The first optical channel is configured to transmit the first light, and the light guide device is configured to guide the first light propagating from the light source into the first optical channel in a manner of light transmission. The optical detector is disposed on the substrate and is configured to receive a second light. The second optical channel is configured to transmit the second light, and the oblique surface is configured to guide the second light propagating from the second optical channel into the optical detector in a manner of reflection.
Light module for illuminating an outer component of a vehicle, and process for manufacturing such light module
A light module for illuminating an outer component of a vehicle, including: a housing for fastening the light module to the vehicle; a cover mounted on the housing; an inner space delimited between the housing and the cover; a printed circuit board in the inner space; a light source on the printed circuit board and configured for emitting an illumination beam-; and a light guide in the housing facing the light source and extending outside the inner space for guiding the illumination beam along the outer component. The light guide includes an optical fiber extending outside the inner space and a lens positioned between the light source and an entry opening of the optical fiber, such that the illumination beam emitted by the light source is focalized toward the entry opening of the optical fiber. A process for manufacturing such light module is also described.